MC32PF3001A6EP 产品信息|NXP

特点


Power Management IC, i.MX7, pre-prog, 3 buck, 6 LDO, QFN 48

封装


HVQFN48: plastic, thermally enhanced very thin quad flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body

购买选项

工作特点

参数
MCU Supported
i.MX6UL
Supply Voltage [min] (V)
2.8
Supply Voltage [max] (V)
5.5
Output Current (A)
2.75
Number of Buck Regulators
4
Number of LDO
6
Switching Frequency LV Buck (MHz)
2
Number of Boost Regulators
0
参数
Number of Channels
10
Battery Charger
coin cell battery
Ambient Operating Temperature (Min to Max) (℃)
-40 to 85
Safety Level
QM
Device Function
PMICs for i.MX processors
Interface and Input Control
I2C
Junction Temperature (Min to Max) (℃)
-40 to 125
Development Tools
KITPF3000FRDMEVM

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MC32PF3001A6EP(935312927557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
139.5
MC32PF3001A6EPR2(935312927528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
139.5

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC32PF3001A6EP
(935312927557)
No
3
260
40
MC32PF3001A6EPR2
(935312927528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明
MC32PF3001A6EP
(935312927557)
854239
MC32PF3001A6EPR2
(935312927528)
854239

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC32PF3001A6EP
(935312927557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC32PF3001A6EPR2
(935312927528)
MC32PF3001A6EP
(935312927557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC32PF3001A6EP
(935312927557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC32PF3001A6EPR2
(935312927528)

更多信息 PF3001

The PF3001 power management integrated circuit (PMIC) features a configurable architecture that supports numerous outputs with various current ratings as well as programmable voltage and predefined sequencing. This enables the PF3001 to power the core processor, external memory and peripherals to provide a single-chip system power solution in multiple applications, reducing design complexity and lowering overall bill of materials. The high-performance architecture offers a cost-optimized solution for "always ON" applications while PF3000 enables Low Power implementation in consumer and industrial environments.

The PF3001 is ideally suited for i.MX6UL processors, and can also meet the power consumption requirements for another low end i.MX 6 series, including the i.MX 6Solo, i.MX 6SoloLite, i.MX 6SoloX, i.MX7D and i.MX7S. The pin to pin compatibility with the PF3000 makes the i.MX and PF3000/1 solution scalable and allows to reuse the current Board Support Package (BSP) used in multiple reference designs. This provides customers with a platform-level solution from a single supplier to enable faster time to market and reduces engineering effort.

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