UJA113x_系统基础芯片 | NXP 半导体

降压/升压高速CAN/Dual LIN系统基础芯片系列

产品详情

框图

UJA113xHW框图

UJA113xHW Block Diagram

特性

基本信息

  • 专为汽车应用而设计,符合ISO11898-2/5/6标准
  • 根据人体模型(HBM)对CAN/LIN总线引脚的规定,提供±6kV静电放电(ESD)保护
  • CAN/LIN总线引脚、传感器电源输出(VEXT)以及HVIO引脚提供符合IEC61000-4-2标准的±6kV静电放电保护
  • CAN/LIN总线引脚提供±40V短路保护
  • 依照ISO7637-3对电池和CAN/LIN总线引脚进行抗瞬态保护

集成的降压-升压转换器(SMPS)

  • 根据输入电压和输出负载条件,选择自动降压或升压模式,只需单个外部线圈便可运行
  • SMPS作为V1的预稳压器,以及V2可选的预稳压器
  • SMPS可用于直接为外部负载供电

低压差稳压器(LDO)

  • V1稳压器5V或3.3V,具有500mA输出电流能力
  • V2辅助稳压器5V,具有100mA输出电流能力
  • V2可防止对GND和电池短路,用于板外负载

CAN收发器

  • 符合ISO11898-2/5/6标准的1Mbit/s高速CAN收发器,支持CAN FD有源通信在CAN FD数据域中速率高达2Mbit/s
  • 自主式总线偏置,符合ISO11898-6:2013标准
  • UJA113xFD:选择性唤醒功能(部分CAN网络符合ISO11989-6:2013标准)

LIN收发器

  • 一个或两个LIN通道,取决于所选设备
  • 符合LIN 2.x和SAE J2602标准
  • 集成的LIN 从端 电阻
  • 采用优化的曲线整形提高EMC排放性能

高压I/O(UJA113xFD/0型号中不可用)

  • 4或8个输入/输出引脚可单独配置为高边或低边输出驱动器
  • 在OFF模式下对输出提供反向电流保护(接地失效和电池缺失证明)
  • 开路负载诊断与短路保护和诊断
  • 可单独配置为具有唤醒功能的输入
  • 三个HVIO可以单独配置为跛行回家输出

可监测电池电压的A/D转换器

  • 两个通道:10位分辨率,在20V满量程时精确到±300mV
  • 欠压和过压检测

更多

购买/参数










































































































N true 0 PSPUJA113xHWzh 3 封装信息 Package Information t790 1 数据手册 Data Sheet t520 1 选型指南 Selector Guide t528 1 zh zh zh 数据手册 Data Sheet 1 1 2.2 English 1442056165231711635184 PSP 872.8 KB None None documents None 1442056165231711635184 /docs/en/data-sheet/UJA113X_SER.pdf 872756 /docs/en/data-sheet/UJA113X_SER.pdf UJA113X_SER documents N N 2016-09-23 Buck/boost HS-CAN/dual LIN system basis chip /docs/en/data-sheet/UJA113X_SER.pdf /docs/en/data-sheet/UJA113X_SER.pdf Data Sheet N 980000996212993340 2024-05-22 pdf N en Sep 2, 2016 980000996212993340 Data Sheet Y N Buck/boost HS-CAN/dual LIN system basis chip 封装信息 Package Information 1 2 2.0 English 1455079194866728275691 PSP 534.9 KB None None documents None 1455079194866728275691 /docs/en/package-information/SOT1181-2.pdf 534899 /docs/en/package-information/SOT1181-2.pdf SOT1181-2 documents N N 2017-07-25 HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad /docs/en/package-information/SOT1181-2.pdf /docs/en/package-information/SOT1181-2.pdf Package Information N 302435339416912908 2024-01-23 pdf N en Jul 25, 2017 302435339416912908 Package Information Y N HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad 选型指南 Selector Guide 1 3 12 English For system designers who want more efficient motor operation with variable speed and sensorless control, NXP offers H-bridge, brushed and brushless DC motor drivers required to complete system design. 1404924651029729642615 PSP 1.2 MB None None documents None 1404924651029729642615 /docs/en/product-selector-guide/INDCONTANLPRDFL.pdf 1202686 /docs/en/product-selector-guide/INDCONTANLPRDFL.pdf INDCONTANLPRDFL documents N N 2016-10-31 Analog Automotive and Industrial Selector Guide /docs/en/product-selector-guide/INDCONTANLPRDFL.pdf /docs/en/product-selector-guide/INDCONTANLPRDFL.pdf Selector Guide N 553557935274807777 2025-01-05 en Jan 29, 2021 553557935274807777 Selector Guide Y N Analog Automotive and Industrial Selector Guide 3 Chinese 1404924651029729642615zh PSP 1.2 MB None None documents None 1404924651029729642615 /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf 1202686 /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf INDCONTANLPRDFL documents N N 2016-10-31 Analog Automotive and Industrial Selector Guide /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf Selector Guide N 553557935274807777 2025-01-05 pdf N zh Sep 18, 2014 553557935274807777 Selector Guide Y N 面向工业市场的模拟产品 - 简介 false 0 UJA113xHW downloads zh-Hans true 1 Y PSP Y Y 封装信息 1 /docs/en/package-information/SOT1181-2.pdf 2017-07-25 1455079194866728275691 PSP 2 Jul 25, 2017 Package Information None /docs/en/package-information/SOT1181-2.pdf English documents 534899 None 302435339416912908 2024-01-23 N /docs/en/package-information/SOT1181-2.pdf HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad /docs/en/package-information/SOT1181-2.pdf documents 302435339416912908 Package Information N en None Y pdf 2.0 N N HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad 534.9 KB SOT1181-2 N 1455079194866728275691 数据手册 1 /docs/en/data-sheet/UJA113X_SER.pdf 2016-09-23 1442056165231711635184 PSP 1 Sep 2, 2016 Data Sheet None /docs/en/data-sheet/UJA113X_SER.pdf English documents 872756 None 980000996212993340 2024-05-22 N /docs/en/data-sheet/UJA113X_SER.pdf Buck/boost HS-CAN/dual LIN system basis chip /docs/en/data-sheet/UJA113X_SER.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.2 N N Buck/boost HS-CAN/dual LIN system basis chip 872.8 KB UJA113X_SER N 1442056165231711635184 选型指南 1 /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf 2016-10-31 1404924651029729642615zh PSP 3 Sep 18, 2014 Selector Guide None /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf Chinese documents 1202686 None 553557935274807777 2025-01-05 N /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf 面向工业市场的模拟产品 - 简介 /docs/zh/product-selector-guide/INDCONTANLPRDFL.pdf documents 553557935274807777 Selector Guide N zh None Y pdf 3 N N Analog Automotive and Industrial Selector Guide 1.2 MB INDCONTANLPRDFL N 1404924651029729642615 true Y Products

文档

快速参考恩智浦 文档类别.

3 文件

紧凑列表

设计文件

快速参考恩智浦 设计文件类型.

硬件

快速参考恩智浦 板类型.

3 硬件

培训

1 培训

支持

您需要什么帮助?

近期查看的产品

There are no recently viewed products to display.

查看或编辑浏览历史