MC33FS6526NAE 产品信息|NXP

MC33FS6526NAE

正常供应

MC33FS6526NAE

正常供应

特点


System Basis Chip, DCDC 2.2A Vcore FS1B, LQFP48EP

封装


HLQFP48: HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body

购买选项

工作特点

参数
AEC-Q100 Temperature Range
grade 1
ASIL Certification
up to ASIL A, up to ASIL B
Additional Features - Security
2x Fail-safe output, Challenger Watchdog, External IC monitoring, FCCU monitoring, Reset Output, Safe delay, UV/OV Monitoring
Additional Features - Analog
bus short-circuit to battery, overcurrent, overcurrent protected bus, overtemperature, overvoltage, short-circuit, undervoltage
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Device Function
SMPS, linear regulators, system basis chip
Diagnostics
SPI
MCU Supported
MPC56xx, MPC57xx
Num. of Linear/LDO Regulators
3
参数
Number of Boost Regulators
1
Number of Buck Regulators
2
Protection
overcurrent, overtemperature, overvoltage, short-circuit, undervoltage
Output Current (A)
2.2
Sample Exception Availability
N
Supply Voltage [min] (V)
2.7
Supply Voltage [max] (V)
40
Recommended Superset
MC33FS6528CAE

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
MC33FS6526NAE(935426175557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
187.5
MC33FS6526NAER2(935426175528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
187.5

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC33FS6526NAE
(935426175557)
ISO 26262
3
260
40
MC33FS6526NAER2
(935426175528)
ISO 26262
3
260
40

配送

部件/12NC协调关税 (美国)免责声明
MC33FS6526NAE
(935426175557)
854239
MC33FS6526NAER2
(935426175528)
854239

更多信息 FS6500

The FS65 system basis chip (SBC) provides power to MCUs and optimizes energy consumption through DC-DC switching regulators, linear regulators and ultra-low-power saving modes.

Featuring:

  • Advanced functional safety measures to target ASIL B/D applications
  • A serial peripheral interface (SPI) to allow control and diagnostics with the MCU
  • Integration of CAN FD and LIN physical interfaces compliant with the ISO 11898-2,-5, LIN 2.2, 2.1 /J2602-2 standards along with the latest automotive OEM standards for EMC and ESD
  • A range of integrated safety features such as monitoring of critical analog parameters, a fail-safe state machine and an advanced watchdog reduce software complexity with dual-core lock-step MCUs
  • High-temperature capability up to TA = 150 °C and TJ = 175 °C, compliant with AEC-Q100 Grade 0 automotive qualification
更多