带有高速CAN接口的第二代系统基础芯片
封装/质量
质量信息
| 部分/封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
|---|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | ||||||
| MCZ33904D5EK 封装 : HSOP32 |
MCZ33904D5EK (935331844574) |
No | 3 | 260 | 40 | |||
| MCZ33904D5EKR2 (935331844518) |
No | 3 | 260 | 40 | ||||
| MCZ33904D3EK 封装 : HSOP32 |
MCZ33904D3EK (935331842574) |
No | 3 | 260 | 40 | |||
| MCZ33904D3EKR2 (935331842518) |
No | 3 | 260 | 40 | ||||
| MCZ33904C5EK 封装 : HSOP32 |
MCZ33904C5EK (935310942574) |
No | 3 | 260 | 40 | |||
| MCZ33904C5EKR2 (935310942518) |
No | 3 | 260 | 40 | ||||
| MCZ33904C3EK 封装 : HSOP32 |
MCZ33904C3EK (935310937574) |
No | 3 | 260 | 40 | |||
| MCZ33904C3EKR2 (935310937518) |
No | 3 | 260 | 40 | ||||
| MCZ33904B5EK 封装 : HSOP32 |
MCZ33904B5EK (935325519574) |
No | 3 | 260 | 40 | |||
| MCZ33904B5EKR2 (935325519518) |
No | 3 | 260 | 40 | ||||
| MCZ33904B3EK 封装 : HSOP32 |
MCZ33904B3EK (935324361574) |
No | 3 | 260 | 40 | |||
| MCZ33904B3EKR2 (935324361518) |
No | 3 | 260 | 40 | ||||