A3I35D025WGN 产品信息|NXP

A3I35D025WGN

不推荐用于新设计

A3I35D025WGN

不推荐用于新设计

特点


Airfast RF LDMOS Wideband Integrated Power Amplifier, 3200-4000 MHz, 3.4 W Avg., 28 V

封装


FM17F: plastic, flange mounted package; 17 leads flat; 1.02 mm pitch; 17.53 x 9.02 x 2.59 mm body

购买选项

A3I35D025WGNR1

不推荐用于新设计

12NC: 935373851528

详细信息

订购

从分销商处购买

工作特点

参数
fi(RF) [max] (MHz)
4000
Number of pins
17
Package Style
DFM
Amp Class
AB
Test Signal
WCDMA
Supply Voltage (Typ) (V)
28
Class
AB
Die Technology
LDMOS
Thermal Resistance (Spec) (℃/W)
1.7
Security Status
COMPANY PUBLIC
Frequency (Min-Max) (MHz)
3200, 4000
Efficiency (Typ) (%)
17.3
Peak Power (Typ) (W)
35
Frequency Band (Hz)
3200000000, 4000000000
参数
Description
Airfast RF LDMOS Wideband Integrated Power Amplifier, 3200-4000 MHz, 3.4 W Avg., 28 V
fi(RF) [min] (MHz)
3200
Output Power (Typ) (W) @ Intermodulation Level at Test Signal
3.4 @ AVG
Gain (Typ) (dB)
28.9
Power Gain (Typ) (dB) @ f (MHz)
28.9 @ 3600
Frequency (Max) (MHz)
4000
Frequency (Min) (MHz)
3200
Frequency (Min-Max) (GHz)
3.2 to 4
frange [max] (MHz)
4000
frange [min] (MHz)
3200
Rth(j-a) (K/W)
1.7
Matching
input and output impedance matching
Modes of Operation
wideband code division multiple access
Peak Power (Typ) (dBm)
45.4

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
A3I35D025WGNR1(935373851528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
598.1

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
A3I35D025WGNR1
(935373851528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
A3I35D025WGNR1
(935373851528)
854233
EAR99

更多信息 A3I35D025WN

The A3I35D025WN wideband integrated circuit is designed for cellular base station applications requiring very wide instantaneous bandwidth capability. This circuit includes on-chip matching that makes it usable from 3200 to 4000 MHz. Its multi-stage structure is rated for 20 to 32 V operation and covers all typical cellular base station modulation formats.