AFT05MS031N_31 W连续波，136-520MHz，13.6V | NXP 半导体

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136-520MHz，31W，13.6V LDMOS宽带射频功率晶体管

AFT05MS031N
不推荐用于新设计
AFT05MS031NR1和AFT05MS031GNR1专为频率范围在136至520MHz之间的双向对讲机应用而设计。这些器件具有高增益、耐用性、宽带性能，适用于移动无线设备中的大信号、共源放大器应用。

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产品详情

特性

  • 运行频率在136至520MHz之间
  • 未匹配的输入和输出，可适用更宽的频率范围
  • 集成的ESD保护
  • 集成的稳定性增强功能
  • 宽带 - 整个频段全功率
    • 136-174MHz
    • 380-450MHz
    • 450-520MHz
  • 可耐225°C高温的塑料封装
  • 卓越的热性能
  • 高线性度：TETRA、SSB和LTE
  • 高性价比的超模压塑料封装
  • 符合RoHS规范
  • 采用盘卷包装。R1后缀=500个，24mm卷带宽度，13英寸卷盘。
  • 输出级VHF频段移动无线设备
  • 输出级UHF频段移动无线设备

射频性能表

VHF，136-174MHz

13.6Vdc，TA=25°C，连续波
频率
(MHz)		 Gps
(dB)		 ηD
(%)		 P1dB
(W)
136-17423.262.031

UHF，380-520MHz

13.6Vdc，TA=25°C，连续波
频率
(MHz)		 Gps
(dB)		 ηD
(%)		 P1dB
(W)
380-45018.364.131

520MHz窄带

13.6Vdc，TA=25°C，连续波
频率
(MHz)		 Gps
(dB)		 ηD
(%)		 P1dB
(W)
450-52017.762.031
52017.771.433

耐用性，520MHz

频率
(MHz)		 信号类型 VSWR 输入功率
(W)		 测试
电压		 结果
520连续波>65:1
所有相
角		1.1
（3dB
过驱）		17无
器件
退化

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N true 0 PSPAFT05MS031Nzh 9 封装信息 Package Information t790 2 工程设计要点 Technical Notes t521 1 应用笔记 Application Note t789 3 支持信息 Supporting Information t531 1 数据手册 Data Sheet t520 1 白皮书 White Paper t530 1 zh zh zh 数据手册 Data Sheet 1 1 1 English AFT05MS031NR1 and AFT05MS031GNR1 are designed for mobile two-way radio applications with frequencies from 136 to 520 MHz. The high gain, ruggedness and wideband performance of these devices make them ideal for large-signal, common source amplifier applications in mobile radio equipment. 1337968483576694101541 PSP 1.1 MB None None documents None 1337968483576694101541 /docs/en/data-sheet/AFT05MS031N.pdf 1141292 /docs/en/data-sheet/AFT05MS031N.pdf AFT05MS031N documents N N 2016-10-31 AFT05MS031NR1, AFT05MS031GNR1 136-520 MHz, 31 W, 13.6 V Wideband RF Power LDMOS Transistors - Data Sheet /docs/en/data-sheet/AFT05MS031N.pdf /docs/en/data-sheet/AFT05MS031N.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Apr 26, 2013 980000996212993340 Data Sheet Y N AFT05MS031NR1, AFT05MS031GNR1 136-520 MHz, 31 W, 13.6 V Wideband RF Power LDMOS Transistors - Data Sheet 应用笔记 Application Note 3 2 2 English This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. 1075398872032723970051 PSP 235.5 KB None None documents None 1075398872032723970051 /docs/en/application-note/AN1955.pdf 235468 /docs/en/application-note/AN1955.pdf AN1955 documents N N 2016-11-09 Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf /docs/en/application-note/AN1955.pdf Application Note N 645036621402383989 2025-01-28 pdf N en Jul 11, 2024 645036621402383989 Application Note Y N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 3 3 English I989356375600 PSP 910.7 KB None None documents None I989356375600 /docs/en/application-note/AN1907.pdf 910737 /docs/en/application-note/AN1907.pdf AN1907 documents N N 2016-11-09 AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf /docs/en/application-note/AN1907.pdf Application Note N 645036621402383989 2025-01-28 pdf N en May 13, 2009 645036621402383989 Application Note Y N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 4 0 English This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. 1236894638615715664840 PSP 449.7 KB None None documents None 1236894638615715664840 /docs/en/application-note/AN3789.pdf 449688 /docs/en/application-note/AN3789.pdf AN3789 documents N N 2016-10-31 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf /docs/en/application-note/AN3789.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Mar 12, 2009 645036621402383989 Application Note Y N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 工程设计要点 Technical Notes 1 5 0 English This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. 1074535848819727693421 PSP 171.0 KB None None documents None 1074535848819727693421 /docs/en/engineering-bulletin/EB212.pdf 170979 /docs/en/engineering-bulletin/EB212.pdf EB212 documents N N 2016-11-09 Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf /docs/en/engineering-bulletin/EB212.pdf Technical Notes N 389245547230346745 2024-09-13 pdf N en Jan 19, 2004 389245547230346745 Technical Notes Y N Using Data Sheet Impedances for RF LDMOS Devices 封装信息 Package Information 2 6 D English 98ASA99301D, 1265A-03, TO-270-2 Gull Wing 10hW9cFy PSP 86.0 KB None None documents None 10hW9cFy /docs/en/package-information/98ASA99301D.pdf 85976 /docs/en/package-information/98ASA99301D.pdf SOT1731-1 documents N N 2016-10-31 98ASA99301D, TO, 9.65x6.1x2.11, Pitch 4.98, 3 Pins /docs/en/package-information/98ASA99301D.pdf /docs/en/package-information/98ASA99301D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 30, 2016 302435339416912908 Package Information D N 98ASA99301D, TO, 9.65x6.1x2.11, Pitch 4.98, 3 Pins 7 R English 98ASH98117A, 1265-09, TO-270 Surface Mount, 3 Pin Y1003179318854 PSP 91.2 KB None None documents None Y1003179318854 /docs/en/package-information/98ASH98117A.pdf 91219 /docs/en/package-information/98ASH98117A.pdf SOT1732-1 documents N N 2016-10-31 98ASH98117A, TO, 9.65x6.1x2.03, Pitch 6.06, 3 Pins /docs/en/package-information/98ASH98117A.pdf /docs/en/package-information/98ASH98117A.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Feb 26, 2016 302435339416912908 Package Information D N 98ASH98117A, TO, 9.65x6.1x2.03, Pitch 6.06, 3 Pins 支持信息 Supporting Information 1 8 0 English Land Mobile Airfast<sup>&#174;</sup> products: AFT05MS031N and AFT09MS031N 1340065802618738876669 PSP 877.8 KB None None documents None 1340065802618738876669 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf 877821 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf LANDMOBILE_TRN_SI documents N N 2016-10-31 New Generation of Land Mobile Radio Products /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf Supporting Information N 371282830530968666 2022-12-07 pdf N en Jun 15, 2012 371282830530968666 Supporting Information Y N New Generation of Land Mobile Radio Products 白皮书 White Paper 1 9 2 English Describes main benefits of RF power plastic packages and recommendations on PCB layout, mounting and soldering techniques for designs using plastic RF PAs. 1415247676533716175304 PSP 911.8 KB None None documents None 1415247676533716175304 /docs/en/white-paper/RFPLASTICWP.pdf 911768 /docs/en/white-paper/RFPLASTICWP.pdf RFPLASTICWP documents N N 2016-10-31 Designing with Plastic RF Power Transistors White Paper /docs/en/white-paper/RFPLASTICWP.pdf /docs/en/white-paper/RFPLASTICWP.pdf White Paper N 918633085541740938 2024-03-13 pdf N en Sep 24, 2015 918633085541740938 White Paper Y N Designing with Plastic RF Power Transistors White Paper false 0 AFT05MS031N downloads zh-Hans true 1 Y PSP 封装信息 2 /docs/en/package-information/98ASA99301D.pdf 2016-10-31 10hW9cFy PSP 6 Mar 30, 2016 Package Information 98ASA99301D, 1265A-03, TO-270-2 Gull Wing None /docs/en/package-information/98ASA99301D.pdf English documents 85976 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA99301D.pdf 98ASA99301D, TO, 9.65x6.1x2.11, Pitch 4.98, 3 Pins /docs/en/package-information/98ASA99301D.pdf documents 302435339416912908 Package Information N en None D pdf D N N 98ASA99301D, TO, 9.65x6.1x2.11, Pitch 4.98, 3 Pins 86.0 KB SOT1731-1 N 10hW9cFy /docs/en/package-information/98ASH98117A.pdf 2016-10-31 Y1003179318854 PSP 7 Feb 26, 2016 Package Information 98ASH98117A, 1265-09, TO-270 Surface Mount, 3 Pin None /docs/en/package-information/98ASH98117A.pdf English documents 91219 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASH98117A.pdf 98ASH98117A, TO, 9.65x6.1x2.03, Pitch 6.06, 3 Pins /docs/en/package-information/98ASH98117A.pdf documents 302435339416912908 Package Information N en None D pdf R N N 98ASH98117A, TO, 9.65x6.1x2.03, Pitch 6.06, 3 Pins 91.2 KB SOT1732-1 N Y1003179318854 工程设计要点 1 /docs/en/engineering-bulletin/EB212.pdf 2016-11-09 1074535848819727693421 PSP 5 Jan 19, 2004 Technical Notes This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. None /docs/en/engineering-bulletin/EB212.pdf English documents 170979 None 389245547230346745 2024-09-13 N /docs/en/engineering-bulletin/EB212.pdf Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf documents 389245547230346745 Technical Notes N en None Y pdf 0 N N Using Data Sheet Impedances for RF LDMOS Devices 171.0 KB EB212 N 1074535848819727693421 应用笔记 3 /docs/en/application-note/AN1955.pdf 2016-11-09 1075398872032723970051 PSP 2 Jul 11, 2024 Application Note This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. None /docs/en/application-note/AN1955.pdf English documents 235468 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1955.pdf Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf documents 645036621402383989 Application Note N en None Y pdf 2 N N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 235.5 KB AN1955 N 1075398872032723970051 /docs/en/application-note/AN1907.pdf 2016-11-09 I989356375600 PSP 3 May 13, 2009 Application Note None /docs/en/application-note/AN1907.pdf English documents 910737 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1907.pdf AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf documents 645036621402383989 Application Note N en None Y pdf 3 N N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 910.7 KB AN1907 N I989356375600 /docs/en/application-note/AN3789.pdf 2016-10-31 1236894638615715664840 PSP 4 Mar 12, 2009 Application Note This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. None /docs/en/application-note/AN3789.pdf English documents 449688 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN3789.pdf Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 449.7 KB AN3789 N 1236894638615715664840 支持信息 1 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf 2016-10-31 1340065802618738876669 PSP 8 Jun 15, 2012 Supporting Information Land Mobile Airfast<sup>&#174;</sup> products: AFT05MS031N and AFT09MS031N None /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf English documents 877821 None 371282830530968666 2022-12-07 N /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf New Generation of Land Mobile Radio Products /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf documents 371282830530968666 Supporting Information N en None Y pdf 0 N N New Generation of Land Mobile Radio Products 877.8 KB LANDMOBILE_TRN_SI N 1340065802618738876669 数据手册 1 /docs/en/data-sheet/AFT05MS031N.pdf 2016-10-31 1337968483576694101541 PSP 1 Apr 26, 2013 Data Sheet AFT05MS031NR1 and AFT05MS031GNR1 are designed for mobile two-way radio applications with frequencies from 136 to 520 MHz. The high gain, ruggedness and wideband performance of these devices make them ideal for large-signal, common source amplifier applications in mobile radio equipment. None /docs/en/data-sheet/AFT05MS031N.pdf English documents 1141292 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/AFT05MS031N.pdf AFT05MS031NR1, AFT05MS031GNR1 136-520 MHz, 31 W, 13.6 V Wideband RF Power LDMOS Transistors - Data Sheet /docs/en/data-sheet/AFT05MS031N.pdf documents 980000996212993340 Data Sheet N en None Y pdf 1 N N AFT05MS031NR1, AFT05MS031GNR1 136-520 MHz, 31 W, 13.6 V Wideband RF Power LDMOS Transistors - Data Sheet 1.1 MB AFT05MS031N N 1337968483576694101541 白皮书 1 /docs/en/white-paper/RFPLASTICWP.pdf 2016-10-31 1415247676533716175304 PSP 9 Sep 24, 2015 White Paper Describes main benefits of RF power plastic packages and recommendations on PCB layout, mounting and soldering techniques for designs using plastic RF PAs. None /docs/en/white-paper/RFPLASTICWP.pdf English documents 911768 None 918633085541740938 2024-03-13 N /docs/en/white-paper/RFPLASTICWP.pdf Designing with Plastic RF Power Transistors White Paper /docs/en/white-paper/RFPLASTICWP.pdf documents 918633085541740938 White Paper N en None Y pdf 2 N N Designing with Plastic RF Power Transistors White Paper 911.8 KB RFPLASTICWP N 1415247676533716175304 true Y Products

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封装信息 (2)
工程设计要点 (1)
应用笔记 (3)
支持信息 (1)
数据手册 (1)
白皮书 (1)

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