Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
MagniV S12 Relay Driver, 2x HS/ LS, I-sense, 16-bit MCU, 6KB RAM, 48KB Flash, LIN, QFP-EP 48
封装
HLQFP48: HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body
购买选项
MM912G634DV1AE
正常供应
12NC: 935314768557
详细信息
订购
MM912G634DV1AER2
正常供应
12NC: 935314768528
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Additional Features | A/D Converter and Digital I/O, PWM Capable, Stop Mode, Wake, Watchdog Timer |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MM912G634DV1AE(935314768557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 194.8 |
MM912G634DV1AER2(935314768528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 194.8 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MM912G634DV1AE (935314768557) | No | 3 | 260 | 40 | |||
MM912G634DV1AER2 (935314768528) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MM912G634DV1AE (935314768557) | 854239 | 3A991A2 |
MM912G634DV1AER2 (935314768528) | 854239 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MM912G634DV1AE (935314768557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MM912G634DV1AER2 (935314768528) | ||||
MM912G634DV1AE (935314768557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MM912G634DV1AER2 (935314768528) | ||||
MM912G634DV1AE (935314768557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 MM912_634
The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrate an HCS12 MCU with a SMARTMOS® analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application-specific functions, including a LIN transceiver.
Your customer benefits include:
- Integrated MCU and analog features in the same package solution
- A full LIN solution
- Easy control of high-current motors using relays and current sense features
- Reduced space, resulting in enhanced reliability
- Full protection for output stages
- Economical multifunction solution with few components
- Low-power mode flexibility
- Reverse-battery-protected voltage sense