Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
HSOP54: HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body
12NC: 935310373574
详细信息
订购
12NC: 935310373518
详细信息
订购
参数 | 值 |
---|---|
Security Status | COMPANY PUBLIC |
Description | 3.3V SBC HSCAN DUAL LIN |
参数 | 值 |
---|---|
Number of pins | 54 |
Package Style | HSOP |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MCZ33905BD3EK(935310373574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 766.15 | |
MCZ33905BD3EKR2(935310373518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 766.15 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCZ33905BD3EK (935310373574) | No | 3 | 260 | 40 | |||
MCZ33905BD3EKR2 (935310373518) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
MCZ33905BD3EK (935310373574) | 854239 | EAR99 |
MCZ33905BD3EKR2 (935310373518) | 854239 | EAR99 |
部件/12NC | 停产通知 | 上次购买日期 | 上次发货日期 |
---|---|---|---|
MCZ33905BD3EK (935310373574) | - | 2013-02-16 | 2014-02-16 |
MCZ33905BD3EKR2 (935310373518) | - | 2013-02-16 | 2014-02-16 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MCZ33905BD3EK (935310373574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33905BD3EKR2 (935310373518) | ||||
MCZ33905BD3EK (935310373574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The NXP MC33905 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.