SOT1747-3: HSOP54

概述

HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1747-3	HSOP54	surface mount	double	HSOP	7.5 x 17.9 x 2.33	54	plastic

生产代码	Reference Codes	Issue Date
98ASA10506D	E-PDSO-G54(JEDEC	2017-06-11

产品

部分	描述	Quick access
MCZ33905CD5EK	System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC-EP 54	View parametrics
MCZ33905DD3EK	System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, 2/3/4 wakeup, SOIC 32	View parametrics
MCZ33999EK	Low-Side Switch, 16 Channels, SOIC 54	View parametrics
MC33887PEK	H-Bridge, Brushed DC Motor Driver, 5-28V, 5A, Cur FB, Sleep, SM-5, SOICW-EP 54	View parametrics
MCZ33905BD5EK	5.0V SBC HSCAN DUAL LIN	View parametrics
MCZ33905CD3EK	System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, 2/3/4 wakeup, SOIC 32	View parametrics
MCZ33905D5EK	5.0V SBC HSCAN DUAL LIN	View parametrics
MCZ33905DD5EK	System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC-EP 54	View parametrics
MCZ33905BD3EK	3.3V SBC HSCAN DUAL LIN	View parametrics