MCZ33905CS3EK 产品信息|NXP

特点


System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32

封装


HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body

购买选项

MCZ33905CS3EK

使用寿命终止

12NC: 935317568574

详细信息

订购

MCZ33905CS3EKR2

使用寿命终止

12NC: 935317568518

详细信息

订购

工作特点

参数
Supply Voltage [Min to Max] (V)
5.5 to 28
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Device Function
comm transceivers, linear regulators, system basis chip
Data Rate [max] kbps
1000.0
参数
Protection
overtemperature, overvoltage protect, undervoltage
Additional Features - Security
SPI
Diagnostics
SPI

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MCZ33905CS3EK(935317568574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
491.4
MCZ33905CS3EKR2(935317568518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
491.4

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCZ33905CS3EK
(935317568574)
No
3
260
40
MCZ33905CS3EKR2
(935317568518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MCZ33905CS3EK
(935317568574)
854239
EAR99
MCZ33905CS3EKR2
(935317568518)
854239
EAR99

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
MCZ33905CS3EK
(935317568574)
NOTICE
2018-11-30
2019-11-30
MCZ33905DS3EK
(935333215574)
MCZ33905CS3EKR2
(935317568518)
NOTICE
2018-11-30
2019-11-30
MCZ33905DS3EKR2
(935333215518)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCZ33905CS3EK
(935317568574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCZ33905CS3EKR2
(935317568518)
MCZ33905CS3EK
(935317568574)
2018-12-192018-12-20201711018DNU02Product Discontinuation Notice - Align SOIC EOL Dates
MCZ33905CS3EKR2
(935317568518)
MCZ33905CS3EK
(935317568574)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MCZ33905CS3EKR2
(935317568518)

更多信息 MC33905

The NXP MC33905 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.

  • The MC33905 works as an advanced power management unit for the MCU and additional integrated circuits such as sensors and CAN transceivers
  • Built-in enhanced high-speed CAN interface (ISO11898-2 and -5), with local and bus failure diagnostics, protection and fail-safe operation mode.
  • The SBC may include zero, one or two LIN 2.1 interfaces with LIN output pin switches
  • Includes 2 or 3 wake-up input pins than can also be configured as output drivers for flexibility