Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
SSOP32: SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body
12NC: 935323075574
详细信息
订购
12NC: 935323075518
详细信息
订购
参数 | 值 |
---|---|
Security Status | COMPANY PUBLIC |
Description | SBC W/HIGH SPEED CAN 3.3V |
参数 | 值 |
---|---|
Number of pins | 32 |
Package Style | SSOP |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MCZ33903BD3EK(935323075574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 472.0 | |
MCZ33903BD3EKR2(935323075518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 472.0 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCZ33903BD3EK (935323075574) | No | 3 | 260 | 40 | |||
MCZ33903BD3EKR2 (935323075518) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
MCZ33903BD3EK (935323075574) | 854239 | EAR99 |
MCZ33903BD3EKR2 (935323075518) | 854239 | EAR99 |
部件/12NC | 停产通知 | 上次购买日期 | 上次发货日期 |
---|---|---|---|
MCZ33903BD3EK (935323075574) | - | 2013-02-16 | 2014-02-16 |
MCZ33903BD3EKR2 (935323075518) | - | 2013-02-16 | 2014-02-16 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MCZ33903BD3EK (935323075574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33903BD3EKR2 (935323075518) | ||||
MCZ33903BD3EK (935323075574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
MCZ33903BD3EKR2 (935323075518) |
The NXP MC33903 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.