MCZ33903D3EK 产品信息|NXP

特点


System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32

封装


HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body

购买选项

MCZ33903D3EK

正常供应

12NC: 935333155574

详细信息

订购

从分销商处购买

MCZ33903D3EKR2

正常供应

12NC: 935333155518

详细信息

订购

从分销商处购买

工作特点

参数
Number of pins
32
Package Style
HSOP
Recommended Orderable Part Number
MCZ33903D3EK
Function
SPI
Security Status
COMPANY PUBLIC
参数
Description
System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32
Recommended Superset
MCZ33903D3EK
Additional Features - Security
SPI
Part Number
MCZ33903D3EK

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MCZ33903D3EK(935333155574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
487.175
MCZ33903D3EKR2(935333155518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
487.175

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCZ33903D3EK
(935333155574)
No
3
260
40
MCZ33903D3EKR2
(935333155518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MCZ33903D3EK
(935333155574)
854239
EAR99
MCZ33903D3EKR2
(935333155518)
854239
EAR99

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCZ33903D3EK
(935333155574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCZ33903D3EKR2
(935333155518)

更多信息 MC33903

The NXP MC33903 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.

  • The MC33903 works as an advanced power management unit for the MCU and additional integrated circuits such as sensors and CAN transceivers
  • Built-in enhanced high-speed CAN interface (ISO11898-2 and -5), with local and bus failure diagnostics, protection and fail-safe operation mode.
  • The SBC may include zero, one or two LIN 2.1 interfaces with LIN output pin switches.