Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body
12NC: 935333155574
详细信息
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12NC: 935333155518
详细信息
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参数 | 值 |
---|---|
Number of pins | 32 |
Package Style | HSOP |
Recommended Orderable Part Number | MCZ33903D3EK |
Function | SPI |
Security Status | COMPANY PUBLIC |
参数 | 值 |
---|---|
Description | System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32 |
Recommended Superset | MCZ33903D3EK |
Additional Features - Security | SPI |
Part Number | MCZ33903D3EK |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MCZ33903D3EK(935333155574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 487.175 | |
MCZ33903D3EKR2(935333155518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 487.175 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCZ33903D3EK (935333155574) | No | 3 | 260 | 40 | |||
MCZ33903D3EKR2 (935333155518) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
MCZ33903D3EK (935333155574) | 854239 | EAR99 |
MCZ33903D3EKR2 (935333155518) | 854239 | EAR99 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MCZ33903D3EK (935333155574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33903D3EKR2 (935333155518) |
The NXP MC33903 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.