高压USB PD电源开关 | NXP 半导体

高压USB PD电源开关

框图

NX20P5090

NX20P5090 Block Diagram

特性

主要特性

  • 全时段提供两级反向电流保护
  • VBUS和VINT引脚容差均为29V
  • 宽电源电压范围:2.5V至20.0V
  • ISW最大5A连续电流
  • 低导通电阻:30mΩ(典型值)
  • 默认23V OVLO阈值,可通过外部电阻调节
  • 用于限制浪涌电流的内置压摆率控制
  • 低电平有效EN引脚,带内置下拉电阻
  • 开漏ACK引脚,用于表明电源状态良好
  • 过温保护
  • 过压锁定
  • 欠压锁定
  • 反向电流保护
  • 浪涌保护:IEC61000-4-5在VBU上超过±80V
  • IEC61000-4-2:VBUS上的接触放电超过8kV
  • 符合HBM ANSI/ESDA/JEDEC JS-001 Class 2标准时,超过2kV
  • 符合CDM AEC标准Q100-01(JESD22-C101E)
  • 指定温度范围:-40°C至+85°C

购买/参数










































































































N true 0 PSPNX20P5090UKzh 3 应用笔记 Application Note t789 2 数据手册 Data Sheet t520 1 zh zh zh 数据手册 Data Sheet 1 1 1.0 English 1476506359037712315238 PSP 1.1 MB None None documents None 1476506359037712315238 /docs/en/data-sheet/NX20P5090.pdf 1078000 /docs/en/data-sheet/NX20P5090.pdf NX20P5090 documents N N 2016-10-14 High Voltage USB PD Power Switch /docs/en/data-sheet/NX20P5090.pdf /docs/en/data-sheet/NX20P5090.pdf Data Sheet N 980000996212993340 Y 2022-12-07 PDF en Oct 14, 2016 980000996212993340 Data Sheet 1.1 MB N /docs/en/data-sheet/NX20P5090.pdf High Voltage USB PD Power Switch 应用笔记 Application Note 2 2 9.0 English This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. 1442088844452695860837 PSP 3.5 MB Registration without Disclaimer None documents Extended 1442088844452695860837 /secured/assets/documents/en/application-note/AN10439.pdf 3465258 /secured/assets/documents/en/application-note/AN10439.pdf AN10439 documents Y N 2016-10-08 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /webapp/Download?colCode=AN10439&lang_cd=zh /secured/assets/documents/en/application-note/AN10439.pdf Application Note N 645036621402383989 2024-04-23 pdf Y en Jan 27, 2022 645036621402383989 Application Note Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note PDF 3 NX20P3483UK,NX20P5090UK,NX5P3090UK,NX5P3201CUK,NX5P3290UK 1 English NXP provides load switch products for USB Type C/PD and general power distribution applications. The product family includes sink switches with OVP, source switches with OCP, and combo switches. This application note offers layout guideline recommendations, allowing the use of non-HDI PCBs while benefiting from ultra small 0.4mm and 0.5mm pitch WLCSP packages. 1523392898106724527591 PSP 1.4 MB None None documents None 1523392898106724527591 /docs/en/application-note/AN12153_1.pdf 1409996 /docs/en/application-note/AN12153_1.pdf AN12153_1 documents N N 2018-04-10 AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages /docs/en/application-note/AN12153_1.pdf /docs/en/application-note/AN12153_1.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Apr 9, 2018 645036621402383989 Application Note Y N AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages true 0 NX20P5090UK downloads zh-Hans true 1 Y PSP Y Y 应用笔记 2 /secured/assets/documents/en/application-note/AN10439.pdf 2016-10-08 1442088844452695860837 PSP 2 Jan 27, 2022 Application Note This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. PDF Registration without Disclaimer /secured/assets/documents/en/application-note/AN10439.pdf English documents 3465258 None 645036621402383989 2024-04-23 Y /webapp/Download?colCode=AN10439&lang_cd=zh AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /secured/assets/documents/en/application-note/AN10439.pdf documents 645036621402383989 Application Note N en Extended Y pdf 9.0 Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note 3.5 MB AN10439 N 1442088844452695860837 /docs/en/application-note/AN12153_1.pdf 2018-04-10 1523392898106724527591 PSP 3 Apr 9, 2018 Application Note NXP provides load switch products for USB Type C/PD and general power distribution applications. The product family includes sink switches with OVP, source switches with OCP, and combo switches. This application note offers layout guideline recommendations, allowing the use of non-HDI PCBs while benefiting from ultra small 0.4mm and 0.5mm pitch WLCSP packages. None /docs/en/application-note/AN12153_1.pdf English documents 1409996 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN12153_1.pdf AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages /docs/en/application-note/AN12153_1.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages 1.4 MB NX20P3483UK,NX20P5090UK,NX5P3090UK,NX5P3201CUK,NX5P3290UK AN12153_1 N 1523392898106724527591 数据手册 1 /docs/en/data-sheet/NX20P5090.pdf 2016-10-14 1476506359037712315238 PSP 1 Oct 14, 2016 Data Sheet None /docs/en/data-sheet/NX20P5090.pdf English documents 1078000 None 980000996212993340 2022-12-07 /docs/en/data-sheet/NX20P5090.pdf High Voltage USB PD Power Switch /docs/en/data-sheet/NX20P5090.pdf documents 980000996212993340 Data Sheet N en None N PDF 1.0 N High Voltage USB PD Power Switch Y 1.1 MB 1.1 MB NX20P5090 N /docs/en/data-sheet/NX20P5090.pdf 1476506359037712315238 true Y Products

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