MC33662_LIN 2.1/SAEJ2602-2，LIN物理层 | NXP 半导体

安全互联汽车

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LIN2.1/SAEJ2602-2，LIN物理层

MC33662
正常供应

恩智浦MC33662是一款专门用于汽车LIN子总线应用的物理层组件。

  • 旨在支持带控制器局域网(CAN)的汽车网络
  • 您可以通过部件编号选择运行波特率(33662L或33662S为20KB/s，33662J为10KB/s)。
  • 两者都集成了一个用于测试和编程模式的快速波特率(100KB/s)。
  • 该器件具有出色的电磁兼容性(EMC)、辐射排放性能、静电放电(ESD)稳定性，并可在TXD接地短路情况下提供安全保护。

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框图

MC33662

NXP<sup>&#174;</sup> MC33662 Internal Block Diagram
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特性

主要特性

  • 运行电压范围为7.0至18V DC，27V DC时可正常工作，负载突降时可承受40V电压
  • 符合LIN协议规范1.3、2.0、2.1和SAEJ2602-2
  • 主动总线波形整形，具有出色的辐射排放性能
  • 在LIN总线上维持最低15.0kV的ESD(符合IEC61000-4-2)，唤醒引脚上为20kV，VSUP引脚上为25kV
  • 非常高的抗电磁干扰性能
  • 睡眠模式下保持低待机电流
  • 过温保护
  • 通过RXD引脚实现本地和远程唤醒功能
  • 通过RXD引脚实现快速波特率选择
  • 5.0V和3.3V兼容数字输入，无需外部组件

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N true 0 PSPMC33662zh 4 应用笔记 Application Note t789 2 数据手册 Data Sheet t520 1 用户指南 User Guide t792 1 zh 2 1 3.0 English This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. 10jsBvfc PSP 3.5 MB None None documents None 10jsBvfc /docs/en/application-note/AN2409.pdf 3536520 /docs/en/application-note/AN2409.pdf AN2409 N N 2016-10-31 AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf /docs/en/application-note/AN2409.pdf Application Note N Y 645036621402383989 2024-01-19 pdf N en Oct 21, 2014 Application Note t789 应用笔记 Application Note Y N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 2 MC33662BJEF,MC33662BLEF,MC33662BSEF 8.0 English The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. 1314652107281711397941 PSP 774.4 KB None None documents None 1314652107281711397941 /docs/en/data-sheet/MC33662.pdf 774445 /docs/en/data-sheet/MC33662.pdf MC33662 N N 2019-04-23 MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33662.pdf /docs/en/data-sheet/MC33662.pdf Data Sheet N Y 980000996212993340 2022-12-07 pdf N en Dec 18, 2018 Data Sheet t520 数据手册 Data Sheet Y N MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet true zh zh 应用笔记 Application Note 1 3 1.0 English The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. 1225311007711718167766 PSP 1.0 MB None None documents None 1225311007711718167766 /docs/en/application-note/AN3670.pdf 1013814 /docs/en/application-note/AN3670.pdf AN3670 documents N N 2016-10-31 AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf /docs/en/application-note/AN3670.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 29, 2008 645036621402383989 Application Note Y N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 用户指南 User Guide 1 4 1.0 English This Evaluation Board is supplied for preliminary evaluation purposes. This kit is populated with a production device, and gives to you the opportunity to test the device in various configuration cases to quickly evaluate these features. 1314811926049711128730 PSP 1.0 MB None None documents None 1314811926049711128730 /docs/en/user-guide/KT33662UG.pdf 1025055 /docs/en/user-guide/KT33662UG.pdf KT33662UG documents N N 2011-08-31 KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide /docs/en/user-guide/KT33662UG.pdf /docs/en/user-guide/KT33662UG.pdf User Guide N 132339537837198660 2023-06-19 pdf N en Aug 31, 2011 132339537837198660 User Guide Y N KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide false 0 MC33662 downloads zh-Hans true 1 Y PSP Y Y 应用笔记 2 /docs/en/application-note/AN3670.pdf 2016-10-31 1225311007711718167766 PSP 3 Oct 29, 2008 Application Note The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. None /docs/en/application-note/AN3670.pdf English documents 1013814 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN3670.pdf AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf documents 645036621402383989 Application Note N en None Y pdf 1.0 N N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 1.0 MB AN3670 N 1225311007711718167766 /docs/en/application-note/AN2409.pdf 2016-10-31 10jsBvfc PSP 1 Oct 21, 2014 Application Note 应用笔记 This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. None /docs/en/application-note/AN2409.pdf English 3536520 None Application Note 2024-01-19 N /docs/en/application-note/AN2409.pdf AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf documents 645036621402383989 Application Note N Y en None Y t789 pdf 3.0 N N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3.5 MB AN2409 N 10jsBvfc 数据手册 1 /docs/en/data-sheet/MC33662.pdf 2019-04-23 1314652107281711397941 PSP 2 Dec 18, 2018 Data Sheet 数据手册 The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. None /docs/en/data-sheet/MC33662.pdf English 774445 None Data Sheet 2022-12-07 N /docs/en/data-sheet/MC33662.pdf MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33662.pdf documents 980000996212993340 Data Sheet N Y en None Y t520 pdf 8.0 N N MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data Sheet 774.4 KB MC33662BJEF,MC33662BLEF,MC33662BSEF MC33662 N 1314652107281711397941 用户指南 1 /docs/en/user-guide/KT33662UG.pdf 2011-08-31 1314811926049711128730 PSP 4 Aug 31, 2011 User Guide This Evaluation Board is supplied for preliminary evaluation purposes. This kit is populated with a production device, and gives to you the opportunity to test the device in various configuration cases to quickly evaluate these features. None /docs/en/user-guide/KT33662UG.pdf English documents 1025055 None 132339537837198660 2023-06-19 N /docs/en/user-guide/KT33662UG.pdf KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide /docs/en/user-guide/KT33662UG.pdf documents 132339537837198660 User Guide N en None Y pdf 1.0 N N KIT33662JEFEVBE, KIT33662LEFEVBE, Evaluation Board - User Guide 1.0 MB KT33662UG N 1314811926049711128730 true Y Products

文档

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4 文件

紧凑列表

应用笔记 (2)
数据手册 (1)
用户指南 (1)

设计文件

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1-5 / 6 硬件

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