RW610ET 产品信息|NXP

特点


Wireless MCU with Integrated Radio: 1x1 Wi-Fi® 6 + Bluetooth® Low Energy 5.4 Radios

封装


TFBGA145: TFBGA145 very thin fine-pitch ball grid array, 145 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.07 mm body

购买选项

RW610ET/A2IK

正常供应

12NC: 935454729557

详细信息

订购

从分销商处购买

RW610ET/A2IY

正常供应

12NC: 935454729518

详细信息

订购

从分销商处购买

RW610ET/A0IK

停产

12NC: 935441472557

详细信息

订购

RW610ET/A0IY

停产

12NC: 935441472518

详细信息

订购

RW610ET/A1IK

停产

12NC: 935443773557

详细信息

订购

RW610ET/A1IY

停产

12NC: 935443773518

详细信息

订购

工作特点

参数
Package Style
TFBGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
RW610ET/A0IK(935441472557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
131.77767229338002
RW610ET/A0IY(935441472518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
131.77767229338002
RW610ET/A1IK(935443773557)
Yes
Yes
Yes
DREACH SVHC
131.77767229338002
RW610ET/A1IY(935443773518)
Yes
Yes
Yes
DREACH SVHC
131.77767229338002
RW610ET/A2IK(935454729557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
131.77767229338002
RW610ET/A2IY(935454729518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
131.77767229338002

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
无铅焊接无铅焊接
RW610ET/A0IK
(935441472557)
No
3
260
RW610ET/A0IY
(935441472518)
No
3
260
RW610ET/A1IK
(935443773557)
No
3
260
RW610ET/A1IY
(935443773518)
No
3
260
RW610ET/A2IK
(935454729557)
No
3
260
RW610ET/A2IY
(935454729518)
No
3
260

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
RW610ET/A0IK
(935441472557)
854231
5A992C
G184413
RW610ET/A0IY
(935441472518)
854231
5A992C
G184413
RW610ET/A1IK
(935443773557)
854231
5A992C
G184413
RW610ET/A1IY
(935443773518)
854231
5A992C
G184413
RW610ET/A2IK
(935454729557)
854231
5A992C
G184413
RW610ET/A2IY
(935454729518)
854231
5A992C
G184413

更多信息 RW610

The RW610 is a highly integrated, low-power wireless MCU with an integrated MCU and Wi-Fi® 6 + Bluetooth® Low Energy (LE) 5.4 radios designed for a broad array of applications, including connected smart home devices, gaming controllers, enterprise and industrial automation, smart accessories and smart energy.

The RW610 MCU subsystem includes a 260 MHz Arm® Cortex®-M33 core with Trustzone™-M, 1.2 MB on-chip SRAM and a high-bandwidth Quad SPI interface with an on-the-fly decryption engine for securely accessing off-chip XIP flash.

The RW610 includes a full-featured 1x1 dual-band (2.4 GHz/5 GHz) 20 MHz Wi-Fi 6 (802.11ax) subsystem bringing higher throughput, better network efficiency, lower latency and improved range over previous generation Wi-Fi standards. The Bluetooth LE radio supports 2 Mbit/s high-speed data rate, long range and extended advertising.

The integrated EdgeLock® Secure Enclave (Core Profile) offers, secure boot, secure debug, secure firmware updates and secure life cycle management as well as hardware cryptography and physically unclonable function (PUF) for secure key management.

The advanced design of the RW610 delivers tight integration, low power and highly secure operation in a space- and cost-efficient wireless MCU requiring only a single 3.3 V power supply.

Wireless modules based on the NXP RW610 are offered by leading module manufacturers.

更多