MPC8569VJAQLJB 产品信息|NXP

特点


PowerQUICC, 32 Bit Power Architecture SoC, 1067MHz e500, QE, SRIO, PCIe, GbE, DDR2/3, 0-105C

封装


BGA783: BGA783, plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.58 mm body

购买选项

MPC8569VJAQLJB

使用寿命终止

12NC: 935320332557

详细信息

订购

工作特点

参数
Core Type
e500
Operating Frequency [Max] (MHz)
1067
Core: Number of cores (SPEC)
1
Cache (KB)
32
参数
L2 Cache (Max) (KB)
256
External Memory Supported
DDR SDRAM, DDR2 SDRAM, SDRAM
Ambient Operating Temperature (Min to Max) (℃)
0 to 105

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MPC8569VJAQLJB(935320332557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
11154.3

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC8569VJAQLJB
(935320332557)
No
3
245
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC8569VJAQLJB
(935320332557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
MPC8569VJAQLJB
(935320332557)
NOTICE
2020-03-30
2020-09-30
-

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC8569VJAQLJB
(935320332557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8569VJAQLJB
(935320332557)
2019-09-252019-09-26201909022DNDiscontinuance Notice for DSP56303 68360 PBGA only 8569 P5020 8272 Family Lead only 8313 Family Lead only
MPC8569VJAQLJB
(935320332557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC8569E

The MPC8569E PowerQUICC® III family is designed to address the increasing performance requirements for broadband access equipment including 3G/WiMAX/LTE base stations, radio network controllers, gateways and ATM/TDM/IP equipment. The MPC8569E helps facilitate both IP and multi-protocol solutions by combining a high-performance e500 processor core, built on Power Architecture® technology and scaling up to 1.33 GHz, with a flexible communications engine and high-speed system interfaces. The MPC8569E is designed to enable customers to handle many functions in a single-chip solution that otherwise would require multiple devices. This high level of integration provides savings in cost, power and board space.