MPC5554MZP112 产品信息|NXP

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MPC5554MZP112

不推荐用于新设计

MPC5554MZP112

不推荐用于新设计
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特点

NXP 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416

  • 数据手册:
  • PDF

封装

BGA416: BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC5554MZP112

不推荐用于新设计

12NC: 935309507557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 40
  • 起订量: 200
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 $45.50 USD

订购

替换部件
从分销商处购买

MPC5554MZP112R2

不推荐用于新设计

12NC: 935309507518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 500
  • 起订量: 500
  • 交付周期: 12 weeks

订购

替换部件

工作特点

参数值
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416
参数值
Number of pins
416
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量（mg）
MPC5554MZP112(935309507557)
No
No
N
e0
REACH SVHC
3202.8
MPC5554MZP112R2(935309507518)
No
No
N
e0
REACH SVHC
3202.8

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
MPC5554MZP112
(935309507557)
No
3
245
30
MPC5554MZP112R2
(935309507518)
No
3
245
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC5554MZP112
(935309507557)
854231
3A991A2
MPC5554MZP112R2
(935309507518)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知替代器件
MPC5554MZP112
(935309507557)
-
MPC5554MVR132
(935322743557)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC5554MZP112
(935309507557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC5554MZP112R2
(935309507518)
MPC5554MZP112
(935309507557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MPC5554MZP112R2
(935309507518)

更多信息 MPC5554

The MPC5554 MCU enables complex, real-time control for engine management systems. It offers system performance of up to five times that of its MPC500 predecessors along with the reliability and familiarity of proven Power Architecture® technology.

  • Reduces costs by integrating more functionality on-chip
  • Development support speeds time-to-market
  • Supports multiple protocols and customer requirements through intelligent subsystems
  • Offers a migration path from the MPC500 MCUs, facilitating reuse of legacy software architectures