MPC5554MVR80 产品信息|NXP

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MPC5554MVR80

不推荐用于新设计

MPC5554MVR80

不推荐用于新设计
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特点

NXP 32-bit MCU, Power Arch core, 2MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 416

  • 数据手册:
  • PDF

封装

BGA416: BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC5554MVR80

不推荐用于新设计

12NC: 935319212557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 40
  • 起订量: 200
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 US$42.77 USD

订购

从分销商处购买

工作特点

参数值
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 2MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 416
参数值
Number of pins
416
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
MPC5554MVR80(935319212557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
3103.8

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC5554MVR80
(935319212557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)脚印OrCAD Capture符号
MPC5554MVR80
(935319212557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC5554MVR80
(935319212557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC5554MVR80
(935319212557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC5554

The MPC5554 MCU enables complex, real-time control for engine management systems. It offers system performance of up to five times that of its MPC500 predecessors along with the reliability and familiarity of proven Power Architecture® technology.

  • Reduces costs by integrating more functionality on-chip
  • Development support speeds time-to-market
  • Supports multiple protocols and customer requirements through intelligent subsystems
  • Offers a migration path from the MPC500 MCUs, facilitating reuse of legacy software architectures