Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
TSSOP16: TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body
12NC: 935319882574
详细信息
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12NC: 935319882534
详细信息
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参数 | 值 |
---|---|
Flash (kB) | 4 |
RAM (kB) | 0.256 |
Core Type | S08 |
Operating Frequency [Max] (MHz) | 10 |
Bus Frequency (typ) (MHz) | 10 |
参数 | 值 |
---|---|
Supply Voltage [min] (V) | 2.7 |
Supply Voltage [max] (V) | 5.5 |
GPIO | 14 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MC9S08SE4CTG(935319882574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 62.2 | |
MC9S08SE4CTGR(935319882534) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 62.2 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MC9S08SE4CTG (935319882574) | No | 3 | 260 | 40 | |||
MC9S08SE4CTGR (935319882534) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 |
---|---|
MC9S08SE4CTG (935319882574) | 854231 |
MC9S08SE4CTGR (935319882534) | 854231 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MC9S08SE4CTG (935319882574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MC9S08SE4CTGR (935319882534) | ||||
MC9S08SE4CTG (935319882574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
MC9S08SE4CTGR (935319882534) |
The MC9S08SE8 series MCUs are members of the cost-effective, high-performance S08 family of 8-bit microcontroller units (MCUs). All MCUs in the family use the enhanced S08 core and are available with a variety of modules, memory sizes, memory and package types.