MC9S08QB8CGK 产品信息|NXP

特点


S08QB 8-bit MCU, S08 core, 8KB Flash, 20MHz, QFN 24

封装


HVQFN24: HVQFN24, plastic, thermal enhanced very thin quad flat package; no leads; 24 terminals; 0.65 mm pitch; 5 mm x 5 mm x 0.9 mm body

购买选项

工作特点

参数
Core Type
S08

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MC9S08QB8CGK(935314005557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e4
REACH SVHC
58.5

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC9S08QB8CGK
(935314005557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC9S08QB8CGK
(935314005557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC9S08QB8CGK
(935314005557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 S08QB

NXP® understands the challenge of performance within an energy budget and offers a wide portfolio of S08 devices that help you reach target performance levels while minimizing low-power in your design. The S08QB family demonstrates extreme energy-efficiency for ultra-long operating life in battery-powered applications.