SPC5602DF1VLH3 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 256KB Flash, 32MHz, -40/+105degC, Automotive Grade, QFP 64

封装


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

购买选项

SPC5602DF1VLH3R

正常供应

12NC: 935311032528

详细信息

订购

从分销商处购买

工作特点

参数
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 256KB Flash, 32MHz, -40/+105degC, Automotive Grade, QFP 64
参数
Number of pins
64
Package Style
LQFP

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5602DF1VLH3R(935311032528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5602DF1VLH3R
(935311032528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5602DF1VLH3R
(935311032528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5602DF1VLH3R
(935311032528)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5602DF1VLH3R
(935311032528)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.