GPC5602DF1MLL4 产品信息|NXP

安全互联汽车

工业

消费电子

技术

GPC5602DF1MLL4

正常供应

GPC5602DF1MLL4

正常供应
plastic, low profile quad; flat leaded package; 100 terminals; 0.50 mm pitch; 14 x 14 x 1.4 mm body
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特点

NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 100

  • 数据手册:
  • PDF

封装

LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body

购买选项

SPC5602DF1MLL4

正常供应

12NC: 935315251557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 90
  • 起订量: 450
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 1K 在 US$4.10 USD

订购

现货:445

Normally ships in 1-2 business days.

免费样品
从分销商处购买

工作特点

参数值
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 100
参数值
Number of pins
100
Package Style
LQFP

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
SPC5602DF1MLL4(935315251557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2
SPC5602DF1MLL4R(935315251528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5602DF1MLL4
(935315251557)
No
3
260
40
SPC5602DF1MLL4R
(935315251528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5602DF1MLL4
(935315251557)
854231
3A991A2
SPC5602DF1MLL4R
(935315251528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5602DF1MLL4
(935315251557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5602DF1MLL4R
(935315251528)
SPC5602DF1MLL4
(935315251557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments
SPC5602DF1MLL4
(935315251557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
SPC5602DF1MLL4R
(935315251528)

更多信息 MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.