SPC5601DF1MLL4 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 128KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 100

封装


LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body

购买选项

SPC5601DF1MLL4

正常供应

12NC: 935319794557

详细信息

订购

从分销商处购买

工作特点

参数
Flash (kB)
128
RAM (kB)
12
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
48
CAN
1
参数
SCI
3
DSPI
2
GPIO
79
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
3
Supply Voltage [max] (V)
5.5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5601DF1MLL4(935319794557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5601DF1MLL4
(935319794557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5601DF1MLL4
(935319794557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5601DF1MLL4
(935319794557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5601DF1MLL4
(935319794557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments

更多信息 MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.