SPC5603BK0VLH4 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 384KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 64

封装


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

购买选项

SPC5603BK0VLH4

正常供应

12NC: 935314887557

详细信息

订购

从分销商处购买

SPC5603BK0VLH4R

正常供应

12NC: 935314887528

详细信息

订购

从分销商处购买

工作特点

参数
Flash (kB)
384
RAM (kB)
28
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
48
I2C
1
参数
CAN
3
SCI
4
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Supply Voltage [min] (V)
3
Supply Voltage [max] (V)
5.5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5603BK0VLH4(935314887557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6
SPC5603BK0VLH4R(935314887528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5603BK0VLH4
(935314887557)
No
3
260
40
SPC5603BK0VLH4R
(935314887528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5603BK0VLH4
(935314887557)
854231
3A991A2
SPC5603BK0VLH4R
(935314887528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5603BK0VLH4
(935314887557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5603BK0VLH4R
(935314887528)
SPC5603BK0VLH4
(935314887557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5603BK0VLH4R
(935314887528)
SPC5603BK0VLH4
(935314887557)
2018-01-152018-01-16201710028IMPC5604B/C Data Sheet Update to Rev 14 MPC5606B Data Sheet Update to Rev 5 and MPC5607B Data Sheet Update to Rev 9
SPC5603BK0VLH4R
(935314887528)
SPC5603BK0VLH4R
(935314887528)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.