SPC5566MZP80 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 3MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 416

封装


BGA416: BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

SPC5566MZP80

正常供应

12NC: 935316969557

详细信息

订购

从分销商处购买

SPC5566MZP80R

正常供应

12NC: 935316969518

详细信息

订购

从分销商处购买

工作特点

参数
Flash (kB)
3000
RAM (kB)
128
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
80
参数
Bus Frequency (typ) (MHz)
135
CAN
4
SPI
4
GPIO
256
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量(mg)
SPC5566MZP80(935316969557)
No
No
N
e0
REACH SVHC
3202.8
SPC5566MZP80R(935316969518)
No
No
N
e0
REACH SVHC
3202.8

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
SPC5566MZP80
(935316969557)
No
3
260
40
SPC5566MZP80R
(935316969518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)脚印OrCAD Capture符号
SPC5566MZP80
(935316969557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)
SPC5566MZP80R
(935316969518)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5566MZP80
(935316969557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5566MZP80R
(935316969518)

更多信息 MPC5566

Designed for engine management, the NXP MPC5566 embedded controller provides developers with a cost-effective medium to support more sophisticated, memory-intensive timing and control functionality.

  • Helps increase fuel efficiency and improved emissions
  • Allows more advanced engine control systems to be deployed
  • Enables easy migration to next-generation 3 MB flash-embedded controllers
  • Offers system performance of up to five times that of its MPC500 predecessors
  • Ideal for any application that requires complex, real-time control
  • Qualifies for the harshest automotive environments
  • Pin-and code-compatible with other MPC5500 family MCUs
更多