SPC5566MVR144 产品信息|NXP

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工业

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技术

SPC5566MVR144

正常供应

SPC5566MVR144

正常供应
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特点

NXP 32-bit MCU, Power Arch core, 3MB Flash, 144MHz, -40/+125degC, Automotive Grade, PBGA 416

  • 数据手册:
  • PDF

封装

BGA416: BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

SPC5566MVR144

正常供应

12NC: 935319453557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 40
  • 起订量: 200
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 US$50.66 USD

订购

从分销商处购买

工作特点

参数值
Flash (kB)
3000
RAM (kB)
128
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
144
参数值
Bus Frequency (typ) (MHz)
135
CAN
4
SPI
4
GPIO
256
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
SPC5566MVR144(935319453557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
3103.8

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5566MVR144
(935319453557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)脚印OrCAD Capture符号
SPC5566MVR144
(935319453557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5566MVR144
(935319453557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC5566

Designed for engine management, the NXP MPC5566 embedded controller provides developers with a cost-effective medium to support more sophisticated, memory-intensive timing and control functionality.

  • Helps increase fuel efficiency and improved emissions
  • Allows more advanced engine control systems to be deployed
  • Enables easy migration to next-generation 3 MB flash-embedded controllers
  • Offers system performance of up to five times that of its MPC500 predecessors
  • Ideal for any application that requires complex, real-time control
  • Qualifies for the harshest automotive environments
  • Pin-and code-compatible with other MPC5500 family MCUs
更多