SPC5553MZQ112 产品信息|NXP

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SPC5553MZQ112

不推荐用于新设计

SPC5553MZQ112

不推荐用于新设计
sot1129-3_3d
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特点

NXP 32-bit MCU, Power Arch, 1.5MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 324

  • 数据手册:
  • PDF

封装

BGA324: BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body

购买选项

SPC5553MZQ112

不推荐用于新设计

12NC: 935314337557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 60
  • 起订量: 300
  • 交付周期: 12 weeks

订购

从分销商处购买

工作特点

参数值
Flash (kB)
1500
RAM (kB)
64
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
112
Bus Frequency (typ) (MHz)
135
参数值
CAN
2
SPI
3
GPIO
220
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.25

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量（mg）
SPC5553MZQ112(935314337557)
No
No
N
e0
REACH SVHC
1747.85

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
SPC5553MZQ112
(935314337557)
No
3
245
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5553MZQ112
(935314337557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5553MZQ112
(935314337557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC5553

The NXP MPC5553 embedded controller provides an ideal solution for mid-range engine management applications and industrial uses cases requiring complex, real-time control.

  • Includes on-chip fast Ethernet controller (FEC)
  • Delivers system performance of up to five times that of its MPC500 predecessors
  • Supports multiple protocols and customer requirements through intelligent subsystems
  • Integrates more functionality on-chip for greater cost effectiveness
  • Offers a migration path from the market-leading MPC500 family MCUs, facilitating reuse of legacy software architectures
  • Simplifies and speeds designs through comprehensive development tools
更多