SPC5534MVZ80 产品信息|NXP

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SPC5534MVZ80

不推荐用于新设计

SPC5534MVZ80

不推荐用于新设计
sot1129-3_3d
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特点

NXP 32-bit MCU, Power Arch core, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 324

  • 数据手册:
  • PDF

封装

BGA324: BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body

购买选项

SPC5534MVZ80

不推荐用于新设计

12NC: 935310268557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 60
  • 起订量: 300
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 $24.36 USD

订购

从分销商处购买

SPC5534MVZ80R

不推荐用于新设计

12NC: 935310268518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 500
  • 起订量: 500
  • 交付周期: 12 weeks

订购

从分销商处购买

工作特点

参数值
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, PBGA 324
参数值
Number of pins
324
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
SPC5534MVZ80(935310268557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
1713.75
SPC5534MVZ80R(935310268518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
1713.75

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5534MVZ80
(935310268557)
No
3
260
40
SPC5534MVZ80R
(935310268518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5534MVZ80
(935310268557)
854231
3A991A2
SPC5534MVZ80R
(935310268518)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5534MVZ80
(935310268557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5534MVZ80R
(935310268518)
SPC5534MVZ80
(935310268557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5534MVZ80R
(935310268518)

更多信息 MPC5534

The NXP MPC5534 MCU provides an ultra-low cost solution for low-end engine management applications.

  • Supports applications requiring complex, real-time control
  • Offers system performance along with the reliability and familiarity of the proven Power Architecture®
  • Controls design costs for increasingly complex applications
  • Includes a peripheral set specifically tailored for automotive and industrial applications
  • Delivers more on-chip functionality than the current MPC500 family
  • Offers a migration path from the MPC500 family, facilitating reuse of legacy software architectures
更多