SPC5533MVM80 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch, 768KB Flash, 80MHz, -40/+125degC, Automotive Grade, MAPBGA 208

封装


BGA208: BGA208, plastic, ball grid array package; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.15 mm body

购买选项

SPC5533MVM80R

停产

12NC: 935309843518

详细信息

订购

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5533MVM80R(935309843518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
830.3

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5533MVM80R
(935309843518)
No
3
240
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5533MVM80R
(935309843518)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5533MVM80R
(935309843518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC5534

The NXP MPC5534 MCU provides an ultra-low cost solution for low-end engine management applications.

  • Supports applications requiring complex, real-time control
  • Offers system performance along with the reliability and familiarity of the proven Power Architecture®
  • Controls design costs for increasingly complex applications
  • Includes a peripheral set specifically tailored for automotive and industrial applications
  • Delivers more on-chip functionality than the current MPC500 family
  • Offers a migration path from the MPC500 family, facilitating reuse of legacy software architectures
更多