SPC5517EAMLU66 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 176

封装


LQFP176: LQFP176, plastic, low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body

购买选项

SPC5517EAMLU66

正常供应

12NC: 935317123557

详细信息

订购

现货:540
从分销商处购买

工作特点

参数
Flash (kB)
1500
RAM (kB)
80
Core Type
e200
Core: Number of cores (SPEC)
2
Operating Frequency [Max] (MHz)
66
CAN
5
参数
I2C
1
SPI
4
GPIO
145
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.25

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5517EAMLU66(935317123557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
1868.5

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5517EAMLU66
(935317123557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5517EAMLU66
(935317123557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5517EAMLU66
(935317123557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC5510

Designed for body electronics, the NXP MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.

  • Offers high-performance while continuing to meet low-power requirements
  • Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
  • Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
  • Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
  • Backed by a third-party ecosystem of development tools and software
更多