Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
NXP 32-bit MCU, Power Arch, 1.5MB Flash, 80MHz, -40/+105degC, Automotive Grade, MAPBGA 208
封装
BGA208: BGA208, plastic, ball grid array package; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.15 mm body
购买选项
MPC5517GAVMG80
正常供应
12NC: 935322912557
详细信息
订购
SPC5517GAVMG80
正常供应
12NC: 935322911557
详细信息
订购
现货:450
从分销商处购买工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 1500 |
RAM (kB) | 80 |
Core Type | e200 |
Core: Number of cores (SPEC) | 2 |
Operating Frequency [Max] (MHz) | 80 |
CAN | 6 |
| 参数 | 值 |
|---|---|
I2C | 1 |
SPI | 4 |
GPIO | 145 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 4.5 |
Supply Voltage [max] (V) | 5.25 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MPC5517GAVMG80(935322912557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 828.9 |
SPC5517GAVMG80(935322911557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e2 | REACH SVHC | 828.9 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MPC5517GAVMG80 (935322912557) | No | 3 | 260 | 40 | |||
SPC5517GAVMG80 (935322911557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MPC5517GAVMG80 (935322912557) | 854231 | 3A991A2 |
SPC5517GAVMG80 (935322911557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MPC5517GAVMG80 (935322912557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5517GAVMG80 (935322911557) | ||||
MPC5517GAVMG80 (935322912557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 MPC5510
Designed for body electronics, the NXP MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.
- Offers high-performance while continuing to meet low-power requirements
- Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
- Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
- Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
- Backed by a third-party ecosystem of development tools and software