Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
TSSOP20: TSSOP20, plastic, thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 1.05 mm body
12NC: 935316866574
详细信息
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12NC: 935316866518
详细信息
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参数 | 值 |
---|---|
Flash (kB) | 8 |
RAM (kB) | 0.512 |
Core Type | S08 |
Operating Frequency [Max] (MHz) | 20 |
I2C | 1 |
SPI | 1 |
参数 | 值 |
---|---|
Supply Voltage [min] (V) | 2.7 |
Supply Voltage [max] (V) | 5.5 |
GPIO | 16 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
SCI | 1 |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
S9S08SG8E2CTJ(935316866574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 81.4 | |
S9S08SG8E2CTJR(935316866518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 81.4 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
S9S08SG8E2CTJ (935316866574) | No | 3 | 260 | 40 | |||
S9S08SG8E2CTJR (935316866518) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
---|---|---|
S9S08SG8E2CTJ (935316866574) | 854231 | EAR99 |
S9S08SG8E2CTJR (935316866518) | 854231 | EAR99 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
S9S08SG8E2CTJ (935316866574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
S9S08SG8E2CTJR (935316866518) | ||||
S9S08SG8E2CTJ (935316866574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
NXP’s 8-bit S08SG family of microcontrollers (MCUs) is an entry-level to mid-range offering designed for LIN follower, general market, high-temperature (up to 150 °C ambient) and space-constrained applications. The SG is easy to design into an application because of its non-intrusive, single-wire background debug module (BDM), which allows you to read registers without stopping execution on the chip. This reduces development time, since changes can be made while in application and in real time. It also allows debug access in constrained locations. The SG helps to lower cost, save board space and improve quality with on-chip components by eliminating the need for external crystal, low-voltage interrupt (LVI) circuit, voltage regulator, I/O mux, watchdog circuit, analog-to-digital converter (ADC) and development tools.
The SG family is also pin-compatible with the S08EL and S08SL families. This flexibility allows for upgrading and downgrading without major board redesign or long and expensive development times.