Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LQFP44: LQFP44, plastic, low profile quad flat package; 44 terminals; 0.8 mm pitch; 10 mm x 10 mm x 1.4 mm body
购买选项
MC9S08JM16CLD
使用寿命终止
12NC: 935313909557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 16 |
RAM (kB) | 1 |
Core Type | S08 |
Operating Frequency [Max] (MHz) | 24 |
Bus Frequency (typ) (MHz) | 24 |
I2C | 1 |
| 参数 | 值 |
|---|---|
SPI | 2 |
Supply Voltage [min] (V) | 2.7 |
Supply Voltage [max] (V) | 5.5 |
GPIO | 33 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
SCI | 2 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MC9S08JM16CLD(935313909557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 356.1 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MC9S08JM16CLD (935313909557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MC9S08JM16CLD (935313909557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MC9S08JM16CLD (935313909557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
更多信息 S08JM
The S08JM family extends NXP’s entry-level USB portfolio. Featuring on-chip USB 2.0 full-speed device support, it provides a fast, economical and easy way to standardize serial communications in industrial and consumer applications. All MCUs in the S08JM family use the enhanced S08 core. Additionally, NXP® provides two complimentary USB software stacks to help designers simplify applications with USB functionality: USB-LITE Stack by CMX and the USB-MINI Stack by NXP.