LA1235X7S88AB 产品信息|NXP

LA1235X7S88AB

正常供应

LA1235X7S88AB

正常供应

特点


Layerscape® Access LA12xx Programmable Baseband Processor

封装


FBGA621: FBGA621, plastic, fine-pitch ball grid array package; 621 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.37 mm body

购买选项

LA1235X7S88AB

正常供应

12NC: 935438872557

详细信息

订购

工作特点

参数
Number of pins
621
Package Style
FBGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
LA1235X7S88AB(935438872557)
No
Yes
Certificate Of Analysis (CoA)
Yes
HREACH SVHC
1285.9

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
LA1235X7S88AB
(935438872557)
No
3
250
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
LA1235X7S88AB
(935438872557)
854231
3A001A14B1

更多信息 LA12xx

The Layerscape Access LA12xx family of programmable baseband processors delivers high-performance digital signal processing capabilities, performance scalability and application flexibility for 5G sub-6 GHz and mmWave Fixed Wireless Access equipment such as Integrated Small Cells, O-RAN Distributed Unit and Radio Unit and Customer Premises Equipment (CPE). It can be also used in proprietary wireless applications such as defense and civilian radio systems and non-terrestrial networks (NTN).

The family is equipped with a unique combination of:

  • High performance Vector Signal Processing Accelerators (VSPA)
  • Forward Error Correction Accelerator (FECA)
  • Integrated data converting subsystem (ADC/DAC)

For additional information and sample availability, contact NXP Support.

更多