G9S08DN32F2CLC 产品信息|NXP

特点


8-bit MCU, S08 core, 32KB Flash, 40MHz, -40/+85degC, Automotive Qualified, QFP 32

封装


LQFP32: LQFP32, plastic, low profile quad flat package; 32 terminals; 0.8 mm pitch; 7 mm x 7 mm x 1.4 mm body

购买选项

S9S08DN32F2CLC

正常供应

12NC: 935311865557

详细信息

订购

从分销商处购买

工作特点

参数
Flash (kB)
32
RAM (kB)
1.5
Operating Frequency [Max] (MHz)
20
Bus Frequency (typ) (MHz)
20
I2C
1
SPI
1
参数
Supply Voltage [min] (V)
2.7
Supply Voltage [max] (V)
5.5
GPIO
26
Ambient Operating Temperature (Min to Max) (℃)
-40 to 85
SCI
1

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
S9S08DN32F2CLC(935311865557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
188.6
S9S08DN32F2CLCR(935311865528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
188.5105

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
S9S08DN32F2CLC
(935311865557)
No
3
260
40
S9S08DN32F2CLCR
(935311865528)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
S9S08DN32F2CLC
(935311865557)
854231
3A991A2
S9S08DN32F2CLCR
(935311865528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
S9S08DN32F2CLC
(935311865557)
2025-04-162025-05-26202504008IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
S9S08DN32F2CLCR
(935311865528)
S9S08DN32F2CLC
(935311865557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
S9S08DN32F2CLCR
(935311865528)
S9S08DN32F2CLC
(935311865557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
S9S08DN32F2CLCR
(935311865528)

更多信息 S08D

We have developed the industry's first 8-bit microcontroller family with embedded CAN, embedded EEPROM and on-chip emulation/debug for the automotive and industrial markets. The S08D family offers designers scalability and flexibility of migration with pin, peripheral and tool compatibility between S08D family devices.

This highly integrated next generation family of MCUs is packed with features designed to provide increased performance, as well as save power, development time, board space and cost.

Learn More

更多