Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
购买选项
88W8997-A1-CBQE/AZ
正常供应
12NC: 935391308092
详细信息
订购
工作特点
无相关信息
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
88W8997-A1-CBQE/AZ(935391308092) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 27.218956 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | ||
|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | ||||
88W8997-A1-CBQE/AZ (935391308092) | No | 1 | 260 | ||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | CCATS |
|---|---|---|---|
88W8997-A1-CBQE/AZ (935391308092) | 854231 | 5A992C | G183578 |
更多信息 88W8997
The 88W8997 is the industry’s first 28nm, 802.11ac wave-2, 2x2 MU-MIMO combo solution with full support for Bluetooth 5.3. The design enhancements and the low power 28nm process technology reduces the power consumption by up to 40% over existing solutions. 88W8997 features the highest level of integration in the market including dual band Power Amplifiers (PAs), Low Noise Amplifiers (LNAs) and switches reducing board level BOM (Bill of Materials) to the bare minimum, enabling easy Chip-on-Board and module design for board markets.
Wireless modules based on the NXP 88W8997 are offered by leading module manufacturers.