88W8977-A1-NMVE 产品信息|NXP

88W8977-A1-NMVE

正常供应

88W8977-A1-NMVE

正常供应

特点


2.4/5 GHz Dual-Band 1x1 Wi-Fi® 4 (802.11n) + Bluetooth® 5.2 Solution

封装


HVQFN68: HVQFN68, thermal enhanced very thin quad flat package, no leads, 68 terminals, 0.4 mm pitch, 8 mm x 8 mm x 0.85 mm body

购买选项

88W8977-A1-NMVE/AK

正常供应

12NC: 935391288557

详细信息

订购

从分销商处购买

88W8977-A1-NMVE/AZ

正常供应

12NC: 935391288517

详细信息

订购

从分销商处购买

88W8977-A1-NMVE/BK

需要特定资质

12NC: 935402581557

详细信息

订购

88W8977-A1-NMVE/BZ

需要特定资质

12NC: 935402581517

详细信息

订购

88W8977-A1-NMVEAMP

停产

12NC: 935402581528

详细信息

订购

88W8977-A1-NMVE/MP

停产

12NC: 935391288528

详细信息

订购

工作特点

参数
Number of pins
68
Package Style
HVQFN

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
88W8977-A1-NMVE/AK(935391288557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
160.36157215999998
88W8977-A1-NMVEAMP(935402581528)
Yes
Yes
Yes
DREACH SVHC
160.36157215999998
88W8977-A1-NMVE/AZ(935391288517)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
160.36157215999998
88W8977-A1-NMVE/BK(935402581557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
160.36157215999998
88W8977-A1-NMVE/BZ(935402581517)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
160.36157215999998
88W8977-A1-NMVE/MP(935391288528)
Yes
Yes
Yes
DREACH SVHC
160.36157215999998

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
无铅焊接无铅焊接
88W8977-A1-NMVE/AK
(935391288557)
No
3
260
88W8977-A1-NMVEAMP
(935402581528)
No
3
260
88W8977-A1-NMVE/AZ
(935391288517)
No
3
260
88W8977-A1-NMVE/BK
(935402581557)
No
3
260
88W8977-A1-NMVE/BZ
(935402581517)
No
3
260
88W8977-A1-NMVE/MP
(935391288528)
No
3
260

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
88W8977-A1-NMVE/AK
(935391288557)
854231
5A992C
G183578
88W8977-A1-NMVEAMP
(935402581528)
854231
5A992C
G183578
88W8977-A1-NMVE/AZ
(935391288517)
854231
5A992C
G183578
88W8977-A1-NMVE/BK
(935402581557)
854231
5A992C
G183578
88W8977-A1-NMVE/BZ
(935402581517)
854231
5A992C
G183578
88W8977-A1-NMVE/MP
(935391288528)
854231
5A992C
G183578

更多信息 88W8977

The 88W8977 System-on-Chip (SoC) is a highly integrated single-chip solution that incorporates both Wi-Fi (2.4/5 GHz) and Bluetooth technology. The IEEE 802.11n compliant dual-band system-on-chip offers Wi-Fi data rates up to MCS 7 (150 Mbit/s). The SoC is specifically designed to support the speed, reliability, and quality requirements of devices such as wearables, Internet of Things (IoT) and smart home applications. The Combo solution provides both simultaneous and independent operation of the IEEE 802.11n compliant 1x1 spatial stream and Bluetooth 5.2 with high speeds and mesh networking for increased Internet of Things (IoT) functionality.

Wireless modules based on the NXP 88W8977 are offered by leading module manufacturers.