Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LQFP32: LQFP32, plastic, low profile quad flat package; 32 terminals; 0.8 mm pitch; 7 mm x 7 mm x 1.4 mm body
购买选项
S56F8013W3MFAE
正常供应
12NC: 935314709557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 16 |
RAM (kB) | 4 |
Operating Frequency [Max] (MHz) | 32 |
I2C | 1 |
| 参数 | 值 |
|---|---|
SPI | 2 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
Supply Voltage [Min to Max] (V) | 3 to 3.6 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
S56F8013W3MFAE(935314709557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 188.6 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
S56F8013W3MFAE (935314709557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
S56F8013W3MFAE (935314709557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
S56F8013W3MFAE (935314709557) | 2025-04-16 | 2025-05-26 | 202504008I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
S56F8013W3MFAE (935314709557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
S56F8013W3MFAE (935314709557) | 2017-12-21 | 2018-01-19 | 201711004I | MC9328MX21 MC56F825x/MC56F824x 56F8013 Final Test Site Expansion from NXP-ATTJ to KESC Tianjin China |
更多信息 56F801X
The NXP® 56F801X DSC family combines the power of digital signal processing and the functionality of a microcontroller on a single chip, with a flexible set of peripherals.
- Provides high-performance 16-bit solutions for motor control applications that require a greater number of pulse width modulators (PWMs)
- Delivers more control functionality with a smaller memory footprint than competing architectures
- Includes flexible power saving modes
- On-chip integration and ease of implementation help to speed development, lower component count, and significantly reduce system cost
- Supported by robust development tools to simplify and accelerate time-to-market