MPC8379VRAJFA 产品信息|NXP

特点


PowerQUICC, 32 Bit Power Arch SoC, 533MHz, DDR1/2, PCI, 1GbE, USB, SATA, 0 to 105C, Rev 1

封装


HBGA689: HBGA689, plastic, thermal enhanced ball grid array; 689 balls; 1 mm pitch; 31 mm x 31 mm x 1.86 mm body

购买选项

MPC8379VRAJFA

使用寿命终止

12NC: 935317516557

详细信息

订购

工作特点

参数
Core Type
e300
Operating Frequency [Max] (MHz)
533
参数
External Memory Supported
DDR1 SDRAM, DDR2 SDRAM, EPROM
Ambient Operating Temperature (Min to Max) (℃)
0 to 125

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MPC8379VRAJFA(935317516557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
5268.0

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC8379VRAJFA
(935317516557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC8379VRAJFA
(935317516557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
MPC8379VRAJFA
(935317516557)
NOTICE
2021-09-09
2022-09-09
-

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC8379VRAJFA
(935317516557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC8379VRAJFA
(935317516557)
2021-03-042021-03-05202102034DNDiscontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MPC8379VRAJFA
(935317516557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8379VRAJFA
(935317516557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC8379E

Today’s small-to-medium businesses and consumer applications are driving the need for highly integrated and cost-effective solutions that deliver high-performance. The MPC8379E provides a high performance Power Architecture® e300 core up to 800 MHz with 32K I/D L1 cache, and integrated x4 serial ATA controllers that help to reduce overall BOM cost. The system-on-chip (SoC) also includes two Gigabit Ethernet (GbE) controllers for network connectivity and a security engine for encryption algorithm offload. The MPC8379E, based in 90 nm process technology, provides high integration that simplifies board design and provides a cost-effective solution for critical applications such as network attached storage.

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