MPC8245TZU350D 产品信息|NXP

特点


32 Bit Power Architecture, 350MHz, Integrated Host Processor, PCI, -40 to 105C

封装


LBGA352: LBGA352, plastic, low profile ball grid array; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.05 mm body

购买选项

MPC8245TZU350D

使用寿命终止

12NC: 935319153557

详细信息

订购

工作特点

参数
Core Type
603e
Operating Frequency [Max] (MHz)
350
参数
External Memory Supported
EPROM, SDRAM
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量(mg)
MPC8245TZU350D(935319153557)
No
No
N
e0
REACH SVHC
9247.0

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接无铅焊接铅焊接无铅焊接
MPC8245TZU350D
(935319153557)
No
3
220
220
30
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)脚印OrCAD Capture符号
MPC8245TZU350D
(935319153557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

停产和更换部件数据

部件/12NC停产通知替代器件
MPC8245TZU350D
(935319153557)
-
MPC8245TVV350D
(935322709557)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC8245TZU350D
(935319153557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8245TZU350D
(935319153557)
2018-08-242018-11-21201803021F01MPC8245 and MPC8250/8255/8260/8265 TBGA Product Family Conversion to Center Gate Mold Process
MPC8245TZU350D
(935319153557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC8245

The MPC8245 Integrated Host Processor supports applications where cost, space, power consumption and performance are critical requirements.

  • Provides a high level of integration, significantly reducing system component cost
  • Simplifies board design, reduces power consumption and accelerates faster-time-to-market
  • Targets systems using PCI interfaces in networking infrastructure, telecommunications, and other embedded markets.
  • Enables control processing for routers, switches, network storage applications and image display systems