Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
NXP 32-bit MCU, Power Arch, 512KB Flash, 56MHz, -40/+125degC, Automotive Grade, PBGA 388
封装
BGA388: BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body
购买选项
SPCZ563MZP56C
使用寿命终止
12NC: 935310225557
详细信息
订购
SPCZ563MZP56CR2
使用寿命终止
12NC: 935310225518
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | NXP 32-bit MCU, Power Arch, 512KB Flash, 56MHz, -40/+125degC, Automotive Grade, PBGA 388 |
| 参数 | 值 |
|---|---|
Number of pins | 388 |
Package Style | BGA |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
SPCZ563MZP56C(935310225557) | No | No |  | e0 | REACH SVHC | 2450.85 |
SPCZ563MZP56CR2(935310225518) | No | No | | e0 | REACH SVHC | 2450.85 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 铅焊接 | 铅焊接 | 铅焊接 | |||||
SPCZ563MZP56C (935310225557) | No | 3 | 240 | 30 | |||
SPCZ563MZP56CR2 (935310225518) | No | 3 | 240 | 30 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
SPCZ563MZP56C (935310225557) | 854231 | 3A991A2 |
SPCZ563MZP56CR2 (935310225518) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
SPCZ563MZP56C (935310225557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPCZ563MZP56CR2 (935310225518) |
更多信息 MPC563
The MPC563 is a high-speed 32-bit control unit that combines high-performance data manipulation capabilities with powerful peripheral subsystems. This MCU is built up from standard modules that interface through a common intermodule bus (IMB).