MPC563MZP56 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch, 512KB Flash, 56MHz, -40/+125degC, Automotive Grade, PBGA 388

封装


BGA388: BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC563MZP56

使用寿命终止

12NC: 935313628557

详细信息

订购

从分销商处购买

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量(mg)
MPC563MZP56(935313628557)
No
No
N
e0
REACH SVHC
2450.85
MPC563MZP56R2(935313628518)
No
No
N
e0
REACH SVHC
2450.85

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接无铅焊接铅焊接无铅焊接
MPC563MZP56
(935313628557)
No
3
240
240
30
30
MPC563MZP56R2
(935313628518)
No
3
240
-
30
-

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC563MZP56
(935313628557)
854231
3A991A2
MPC563MZP56R2
(935313628518)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知替代器件
MPC563MZP56
(935313628557)
-
MPC563MVR56
(935316701557)
MPC563MZP56R2
(935313628518)
-
MPC563MVR56R2
(935316701518)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC563MZP56
(935313628557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC563MZP56R2
(935313628518)
MPC563MZP56
(935313628557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MPC563MZP56R2
(935313628518)

更多信息 MPC563

The MPC563 is a high-speed 32-bit control unit that combines high-performance data manipulation capabilities with powerful peripheral subsystems. This MCU is built up from standard modules that interface through a common intermodule bus (IMB).