MPC563MVR56 产品信息|NXP

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MPC563MVR56

使用寿命终止

MPC563MVR56

使用寿命终止
sot1712-1_3d
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特点

NXP 32-bit MCU, Power Arch, 512KB Flash, 56MHz, -40/+125degC, Automotive Grade, PBGA 388

  • 数据手册:
  • PDF

封装

BGA388: BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC563MVR56

使用寿命终止

12NC: 935316701557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 40
  • 起订量: 200
  • 交付周期: 99 weeks
  • 预算报价（不含税）: 10K 在 US$73.64 USD

订购

从分销商处购买

MPC563MVR56R2

使用寿命终止

12NC: 935316701518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 500
  • 起订量: 500
  • 交付周期: 99 weeks
  • 预算报价（不含税）: 10K 在 US$74.08 USD

订购

从分销商处购买

工作特点

参数值
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch, 512KB Flash, 56MHz, -40/+125degC, Automotive Grade, PBGA 388
参数值
Number of pins
388
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
MPC563MVR56(935316701557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
2406.55
MPC563MVR56R2(935316701518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
2406.55

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC563MVR56
(935316701557)
No
3
260
40
MPC563MVR56R2
(935316701518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC563MVR56
(935316701557)
854231
3A991A2
MPC563MVR56R2
(935316701518)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC563MVR56
(935316701557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC563MVR56R2
(935316701518)
MPC563MVR56
(935316701557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC563MVR56R2
(935316701518)
MPC563MVR56
(935316701557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MPC563MVR56R2
(935316701518)

更多信息 MPC563

The MPC563 is a high-speed 32-bit control unit that combines high-performance data manipulation capabilities with powerful peripheral subsystems. This MCU is built up from standard modules that interface through a common intermodule bus (IMB).