SPC5674FK0MVR3 产品信息|NXP

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SPC5674FK0MVR3

正常供应

SPC5674FK0MVR3

正常供应

购买选项

SPC5674FK0MVR3

正常供应

12NC: 935310873557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 40
  • 起订量: 200
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 US$24.66 USD

订购

现货:210

Normally ships in 1-2 business days.

免费样品
从分销商处购买

SPC5674FK0MVR3R

正常供应

12NC: 935310873518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 500
  • 起订量: 500
  • 交付周期: 12 weeks
  • 预算报价（不含税）: 10K 在 US$37.40 USD

订购

类似产品样品

工作特点

参数值
Flash (kB)
4096
RAM (kB)
256
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
270
CAN
4
参数值
SCI
3
DSPI
4
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
SPC5674FK0MVR3(935310873557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
3420.55
SPC5674FK0MVR3R(935310873518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
3420.55

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5674FK0MVR3
(935310873557)
No
3
260
40
SPC5674FK0MVR3R
(935310873518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5674FK0MVR3
(935310873557)
854231
3A991A2
SPC5674FK0MVR3R
(935310873518)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5674FK0MVR3
(935310873557)
2022-11-192022-11-20202209016IMPC574xR Mask 1N83M MPC5676R Mask 3N23A MPC5777C Mask 2N45H and 3N45H MPC567xF Mask 0N31E and 3M17W Errata Update SEP2022
SPC5674FK0MVR3R
(935310873518)
SPC5674FK0MVR3
(935310873557)
2022-03-232022-03-24202202031IMPC567xF Mask 0N31E & 3M17W Errata List Update February 2022
SPC5674FK0MVR3R
(935310873518)
SPC5674FK0MVR3
(935310873557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5674FK0MVR3R
(935310873518)
SPC5674FK0MVR3
(935310873557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC5674F

NXP<sup>®</sup> product built on Power Architecture technology

The MPC5674F

Power Architecture® MCU helps automakers offer more fuel-efficient automobiles and meet stricter government-mandated emissions standards by enabling precise control of engine events without sacrificing performance.

  • Addresses the growing computational demands of green engine designs
  • Designed to reduce time to market at lower costs and with higher reliability
  • Precisely controls fuel delivery and improves gas mileage
  • Performs knock detection without additional external components
  • Condenses code footprint by up to 30% for improved density and reduced memory requirements
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