SPC5673FF3MVY2 产品信息|NXP

特点


NXP 32-bit MCU, Power Arch core, 3MB Flash, 200MHz, -40/+125degC, Automotive Grade, PBGA 516

封装


BGA516: BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

工作特点

参数
Flash (kB)
3072
RAM (kB)
192
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
200
CAN
4
参数
SCI
3
DSPI
4
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
4.5
Supply Voltage [max] (V)
5.5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5673FF3MVY2(935311206557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
4374.4

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5673FF3MVY2
(935311206557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5673FF3MVY2
(935311206557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5673FF3MVY2
(935311206557)
2022-11-192022-11-20202209016IMPC574xR Mask 1N83M MPC5676R Mask 3N23A MPC5777C Mask 2N45H and 3N45H MPC567xF Mask 0N31E and 3M17W Errata Update SEP2022
SPC5673FF3MVY2
(935311206557)
2022-03-232022-03-24202202031IMPC567xF Mask 0N31E & 3M17W Errata List Update February 2022
SPC5673FF3MVY2
(935311206557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC5674F

NXP<sup>®</sup> product built on Power Architecture technology

The MPC5674F

Power Architecture® MCU helps automakers offer more fuel-efficient automobiles and meet stricter government-mandated emissions standards by enabling precise control of engine events without sacrificing performance.

  • Addresses the growing computational demands of green engine designs
  • Designed to reduce time to market at lower costs and with higher reliability
  • Precisely controls fuel delivery and improves gas mileage
  • Performs knock detection without additional external components
  • Condenses code footprint by up to 30% for improved density and reduced memory requirements
更多