Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
NXP 32-bit MCU, Power Arch core, 2MB Flash, 125MHz, -40/+105degC, Automotive Grade, QFP 208
封装
LQFP208: LQFP208, plastic, low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body
购买选项
SPC5645SF1VLT
正常供应
12NC: 935314839557
详细信息
订购
SPC5645SF1VLTR
正常供应
12NC: 935314839528
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 2048 |
RAM (kB) | 1088 |
Operating Frequency [Max] (MHz) | 120 |
I2C | 4 |
| 参数 | 值 |
|---|---|
CAN | 3 |
SCI | 4 |
DSPI | 3 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
SPC5645SF1VLT(935314839557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 2587.0 |
SPC5645SF1VLTR(935314839528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 2587.0 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
SPC5645SF1VLT (935314839557) | No | 3 | 260 | 40 | |||
SPC5645SF1VLTR (935314839528) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
SPC5645SF1VLT (935314839557) | 854231 | 3A991A2 |
SPC5645SF1VLTR (935314839528) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
SPC5645SF1VLT (935314839557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5645SF1VLTR (935314839528) | ||||
SPC5645SF1VLT (935314839557) | 2020-05-09 | 2020-05-10 | 202004027I | MPC5645S Errata Update to Rev 20 Apr 2020 |
SPC5645SF1VLTR (935314839528) | ||||
SPC5645SF1VLT (935314839557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 MPC564xS
The NXP® MPC564xS family of MCUs targets the needs of automotive instrument cluster and industrial markets.
- Includes on-chip display control units that directly drives the TFT displays
- Low-power design enables dynamic power management of core and peripherals
- Offers an industry standard graphics accelerator to help drive sophisticated graphics (e.g., simulated instrument cluster needles or image warping for heads-up displays)
- Offers code compatibility with applications in the MPC560xS environment
- Supported by robust enablement ecosystem to simplify and accelerate development