SPC5604PGF1VLL6 产品信息|NXP

SPC5604PGF1VLL6

正常供应

SPC5604PGF1VLL6

正常供应

特点


NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 100

封装


LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body

购买选项

工作特点

参数
Flash (kB)
512
RAM (kB)
40
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
64
CAN
2
参数
SCI
2
DSPI
4
GPIO
68
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Supply Voltage [min] (V)
3.3
Supply Voltage [max] (V)
5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5604PGF1VLL6(935314424557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2
SPC5604PGF1VLL6R(935314424528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5604PGF1VLL6
(935314424557)
Quality Managed
3
260
40
SPC5604PGF1VLL6R
(935314424528)
Quality Managed
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5604PGF1VLL6
(935314424557)
854231
3A991A2
SPC5604PGF1VLL6R
(935314424528)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5604PGF1VLL6
(935314424557)
2022-11-192022-11-20202209023IMPC5604P Mask 1M36W MPC5643L Mask 0N18H and 2N89D Errata Update SEP2022
SPC5604PGF1VLL6R
(935314424528)
SPC5604PGF1VLL6
(935314424557)
2021-10-302021-10-31202108018IMPC5644A MPC5642A MPC563xM MPC5604P MPC5643L and MPC5744P Errata Update
SPC5604PGF1VLL6R
(935314424528)
SPC5604PGF1VLL6
(935314424557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5604PGF1VLL6R
(935314424528)
SPC5604PGF1VLL6
(935314424557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments

更多信息 MPC560xP

The MPC560xP family of MCUs target sophisticated chassis, automotive and industrial applications. They enable electronic replacement for heavy hydraulic and engine-driven systems.

  • Ensures the latest safety requirements for functional safety applications
  • Reduces system complexity, development time, and bill-of-materials costs
  • Improves fuel efficiency
  • Reduces greenhouse gas emissions