SPC5601PEF0MLH6 产品信息|NXP

SPC5601PEF0MLH6

正常供应

SPC5601PEF0MLH6

正常供应

特点


NXP 32-bit MCU, Power Arch core, 192KB Flash, 64MHz, -40/+125degC, Automotive Grade, QFP 64

封装


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

购买选项

工作特点

参数
Flash (kB)
192
RAM (kB)
12
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
64
CAN
1
参数
SCI
1
DSPI
1
GPIO
37
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
3.3
Supply Voltage [max] (V)
5

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5601PEF0MLH6(935314662557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5601PEF0MLH6
(935314662557)
Quality Managed
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5601PEF0MLH6
(935314662557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5601PEF0MLH6
(935314662557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

更多信息 MPC560xP

The MPC560xP family of MCUs target sophisticated chassis, automotive and industrial applications. They enable electronic replacement for heavy hydraulic and engine-driven systems.

  • Ensures the latest safety requirements for functional safety applications
  • Reduces system complexity, development time, and bill-of-materials costs
  • Improves fuel efficiency
  • Reduces greenhouse gas emissions