Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
- PowerQUICC处理器
- MPC8315CVRAGDA
特点
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI/PCIe, GbE, USB,TDM, SATA, -40 to 105C, Rev 1
封装
HBGA620: HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body
购买选项
MPC8315CVRAGDA
不推荐用于新设计
12NC: 935325395557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | e300 |
Operating Frequency [Max] (MHz) | 400 |
| 参数 | 值 |
|---|---|
External Memory Supported | DDR1 SDRAM, DDR2 SDRAM, SDRAM |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MPC8315CVRAGDA(935325395557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 4272.9 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MPC8315CVRAGDA (935325395557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MPC8315CVRAGDA (935325395557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MPC8315CVRAGDA (935325395557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC8315CVRAGDA (935325395557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 MPC8315E
Increased Internet broadcast and downloads for personal and premium content are driving a need for a secure highly integrated platform for multimedia distribution within the home. The MPC8315E provides a high-performance Power Architecture® e300 core up to 400 MHz with 16K I/D L1 cache and integrated x2 serial ATA controllers that help reduce overall BOM cost. The system-on-chip (SoC) also includes two Gigabit Ethernet® controllers for network connectivity, two x1 PCI Express® lanes, TDM interface for VoIP, high-speed USB 2.0 with PHY integrated and security engine for encryption algorithm offload. The MPC8315E, based in 90 nm process technology, provides high integration that simplifies board design and provides a cost-effective solution for critical applications such as network attached storage.