Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
Kinetis® K20-100 MHz, Full-Speed USB, Mixed-Signal Integration Microcontrollers based on Arm® Cortex®-M4 Core
购买选项
KK20DN512ZCAB10R
正常供应
12NC: 935321917022
详细信息
订购
MK20DN512ZCAB10R
正常供应
12NC: 935321918051
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | Arm Cortex-M0 |
Operating Frequency [Max] (MHz) | 100 |
Flash (kB) | 512 |
I2C | 2 |
USB Controllers | 1 |
CAN | 2 |
GPIO | 79 |
| 参数 | 值 |
|---|---|
ADC (16 bit) | 2 |
16-bit PWM | 1 |
Security | CRC |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|
KK20DN512ZCAB10R(935321917022) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 400.0 |
MK20DN512ZCAB10R(935321918051) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | REACH SVHC | 400.0 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
KK20DN512ZCAB10R (935321917022) | No | 1 | 260 | 40 | |||
MK20DN512ZCAB10R (935321918051) | No | 1 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | 脚印 | OrCAD Capture符号 |
|---|---|---|---|---|
KK20DN512ZCAB10R (935321917022) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
MK20DN512ZCAB10R (935321918051) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
KK20DN512ZCAB10R (935321917022) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
MK20DN512ZCAB10R (935321918051) |
更多信息 K20_100
The Kinetis® K20 100 MHz MCU family offers a scalable portfolio with various levels of integration, featuring a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements.
- Maximizes board space and enhances performance with minimum-length interconnections
- Enables miniaturization of existing applications
- Provides performance efficiency with low power
- Delivers significant BOM savings through smart on-chip integration
- Shares the comprehensive enablement and scalability of the Kinetis portfolio